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Air Cooling Device

A heat dissipation device and air cooling technology, applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve problems such as failure to meet application requirements and poor heat dissipation efficiency of heat dissipation mechanism

Active Publication Date: 2020-03-27
MICROJET TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the heat dissipation efficiency of the aforementioned heat dissipation mechanism is poor, which cannot meet the application requirements

Method used

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Embodiment Construction

[0022] Some typical embodiments embodying the features and advantages of the present application will be described in detail in the description in the following paragraphs. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of this case, and the descriptions and diagrams therein are used as illustrations in nature, rather than construed to limit this case.

[0023] see Figure 2A , Figure 2B and image 3 , Figure 2A It is the structural representation of the air-cooling heat dissipation device of the preferred embodiment of this case, Figure 2B for Figure 2A A structural schematic diagram of the air-cooling heat dissipation device shown in another perspective, and image 3 for Figure 2A The schematic diagram of the structure of the air-cooling heat dissipation device shown in section AA. As shown in the figure, the air-cooling device 2 of this case can be applied to an electronic device, s...

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PUM

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Abstract

An air cooling heat radiating device is used for performing heat radiation on an electronic component. The air cooling heat radiating device comprises a bearing substrate, an air pump and a heat radiator. The bearing substrate comprises an air guiding end opening and a heat transfer board, wherein the heat transfer board is arranged on the upper surface and is arranged correspondingly with the airguiding end opening. The electronic component is arranged on the heat transfer board. The air pump is fixedly arranged at the lower surface of the bearing substrate and correspondingly closes the airguiding end opening. The heat radiator is arranged on the electronic component. Through driving the air pump, the air flows into the air guiding end opening and heat exchanging is performed on the heat transfer, thereby realizing heat radiation of the electronic component.

Description

【Technical field】 [0001] This case relates to an air cooling and heat dissipation device, especially an air cooling and heat dissipation device that uses a gas pump to provide driving airflow for heat dissipation. 【Background technique】 [0002] With the advancement of technology, various electronic devices such as portable computers, tablet computers, industrial computers, portable communication devices, audio-visual players, etc. have developed towards thinner, portable and high-performance trends. These electronic devices Various high-integration or high-power electronic components must be arranged in its limited internal space. In order to make the electronic equipment faster and more powerful, the electronic components inside the electronic equipment will generate more heat during operation. , and lead to high temperature. In addition, most of these electronic devices are designed to be thin, flat and compact, and there is no additional internal space for heat dissipat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20145
Inventor 廖家淯陈世昌黄哲威黄启峰韩永隆
Owner MICROJET TECH