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test device

A technology for testing devices and substrates, which is applied to measuring devices, measuring electrical variables, instruments, etc. It can solve problems such as easy distortion of signals, long distance between the object under test and the signal connector, and reduced test accuracy.

Active Publication Date: 2020-07-07
UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem caused by this technical solution is that the distance between the object under test and the signal connector is too long, resulting in too long signal routing path, and the signal is easily distorted, which reduces the test accuracy.

Method used

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Examples

Experimental program
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Effect test

no. 1 example

[0029] See Figure 1 to Figure 3 As shown, the test device Z provided by the first embodiment of the present invention includes a test substrate 1, a test base 2 and a signal connector 3. The test substrate 1 has a substrate upper surface 110, a substrate lower surface 120, and at least one through hole H connected between the substrate upper surface 110 and the substrate lower surface 120. The test base 2 is arranged on the upper surface 110 of the test substrate 1 to carry the object to be tested (not shown in the figure). The signal connector 3 is disposed on the upper surface 110 of the test substrate 1 and adjacent to at least one through hole H.

[0030] Figure 1 to Figure 3 Four test bases 2 are set on the test substrate 1 as an example. However, in practical applications, the present invention does not limit the number of test bases 2 that can be set on the test substrate 1. Those skilled in the art can follow actual needs. And design. And like Figure 1 to Figure 3 As...

no. 2 example

[0037] See Figure 4 to Figure 8 The test device Z provided by the second embodiment of the present invention is substantially the same as the test device Z of the first embodiment. The difference between the two embodiments is that the test device Z of this embodiment further includes a fixed module 5, which is arranged in In the through hole H, the transmission connector 40 of the signal transmission line 4 is fixed.

[0038] Please see Image 6 , The fixing module 5 includes a horizontal fixing unit 51, an elastic connector 53 and a vertical fixing unit 52. The horizontal fixing unit 51 includes a first fixing unit 511 and a second fixing unit 512, wherein at least one of the first fixing unit 511 and the second fixing unit 512 presses against the transmission joint 40 of the signal transmission line 4 in the first direction N1 , And the first fixing unit 511 and the second fixing unit 512 respectively abut against the inner edge of the through hole H in a third direction N3 ...

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PUM

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Abstract

The invention discloses a test device for testing DUTs (devices under test). The test device comprises a test substrate, test sockets and signal connectors, wherein the test substrate comprises an upper substrate surface, a lower substrate surface and at least one penetrating hole connected between the upper substrate surface and the lower substrate surface. The test sockets are arranged on the upper substrate surface of the test substrate to carry the DUTs. The signal connectors are arranged on the upper substrate surface of the test substrate and adjacent to at least one penetrating hole. The signal connectors are electrically connected to testers through signal transmission lines penetrating through the at least one penetrating hole. The DUTs located in the test sockets are electricallyconnected with the testers sequentially through the test sockets, the test substrate, the signal connectors and the signal transmission lines. Thus, according to the test device, the signal connectors can be electrically connected to the testers through the signal transmission lines penetrating through the at least one penetrating hole.

Description

Technical field [0001] The invention relates to a testing device, in particular to a testing device used for signal testing of an object under test. Background technique [0002] In the prior art, a test method for products with the function of emitting electromagnetic radiation is to provide a test carrier, a test instrument, and a signal connector. The test carrier is equipped with a device under test (DUT) and designed Test sockets, and signal connectors generally penetrate through the test carrier board, and are electrically connected to the test socket on the upper surface of the test carrier board through signal wiring, and are located under the test carrier board. The surface is connected to the test instrument through a signal cable. When the object to be tested is set in the test base, the signal connector provides a signal connection so that the test instrument can input or output signals from the object under test. [0003] However, since the signal connector in the pri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R29/08
CPCG01R29/0871
Inventor 高合助
Owner UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO LTD