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A Grinding and Polishing Fixture for Ultra-thin Parts

A polishing fixture and ultra-thin technology, applied in the direction of the work carrier, etc., can solve the problems of easy deformation, brittleness, and difficulty in cleaning the workpiece, and achieve the effects of being unbreakable, easy to operate, and simple fixture structure.

Active Publication Date: 2019-12-10
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a grinding and polishing fixture for ultra-thin parts, which can effectively clamp ultra-thin parts through the principle of negative pressure adsorption, in order to solve the problems existing in the grinding and polishing of ultra-thin parts, such as fragility, deformation, and difficulty in cleaning workpieces after processing. The fixture has a simple structure and high reliability. It is not easy to fly during the grinding and polishing process. The workpiece has no force and heat deformation. It is convenient to unload the piece after processing and easy to clean.

Method used

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  • A Grinding and Polishing Fixture for Ultra-thin Parts

Examples

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Comparison scheme
Effect test

Embodiment 1

[0022] Example 1: A grinding and polishing fixture for ultra-thin parts, the fixture material is ceramics, the regular holes on the working surface of the fixture are distributed in a fan shape, and the quartz glass workpiece with a thickness of 0.6mm is clamped, and the grinding and polishing experiment is carried out on a ring polishing machine. The middle fixture drives the workpiece to reciprocate on the grinding and polishing machine according to the sinusoidal function. After processing, the thickness of the workpiece is less than 0.2mm, and the flatness of the workpiece is good, without stress deformation and thermal deformation.

Embodiment 2

[0023] Embodiment 2: A kind of ultra-thin parts grinding and polishing jig, the jig material is aluminum alloy, the regular hole on the jig working surface is distributed in a rectangle, and the YAG crystal workpiece with a thickness of 0.4mm is clamped, and the grinding and polishing experiment is carried out on the ring polishing machine. During polishing, the fixture drives the workpiece to reciprocate on the grinding and polishing machine according to the linear function relationship. The thickness of the workpiece after processing is less than 0.1mm, and the flatness of the workpiece is good. The process of loading and unloading the fixture is simple and easy to use.

Embodiment 3

[0024] Example 3: A grinding and polishing jig for ultra-thin parts, the jig material is polytetrafluoroethylene, the regular holes on the working surface of the jig are distributed in circular arcs such as concentric circles, and the silicon wafer workpiece with a thickness of 0.5mm is clamped and carried out on a ring polishing machine In the grinding and polishing experiment, the fixture drives the workpiece to reciprocate on the grinding and polishing machine according to the quadratic function. After processing, the thickness of the workpiece is less than 0.15mm, and the flatness of the workpiece is good. The workpiece is not easy to fly during processing, and the processing yield rate is high.

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Abstract

The invention provides a grinding-polishing clamp for an ultra-thin part. According to the grinding-polishing clamp, a plurality of holes are formed in a working surface of the grinding-polishing clamp; the ultra-thin part is clamped through the negative-pressure adsorption principle; and the holes formed in the working surface of the grinding-polishing clamp are regular. The workpiece thickness and size application scope of the grinding-polishing clamp for the ultra-thin part is wide, and the grinding-polishing clamp has no special requirement for the material of a workpiece; air pressure isadopted as power during the workpiece loading and unloading process of the grinding-polishing clamp, the impact load is low, the workpiece is not prone to breaking, and the workpiece is easy to cleanafter being machined; the scattered regular holes are utilized for adsorbing the workpiece, the optimal arrangement mode and sizes of the regular holes are optimized and determined, the stress distribution during the clamping process is uniform, and the workpiece stress deformation caused by stress concentration is avoided; the clamping reliability of the grinding-polishing clamp is achieved during the actual machining process, the circumstance that the workpiece is broken due to flying during the machining process is reduced, and the machining yield is improved; and the grinding-polishing clamp is simple in structure and convenient to operate, and has very good popularization and application prospects.

Description

technical field [0001] The invention relates to a jig for precision machining, in particular to a jig for grinding and polishing parts, in particular to a jig for grinding and polishing ultra-thin parts. Background technique [0002] Thin parts such as ultra-thin quartz wafers, ultra-thin silicon wafers, ultra-thin stainless steel substrates, ultra-thin glass substrates, ultra-thin germanium single wafers, etc. are widely used in integrated circuits, solar cells, flexible displays and other fields, and have a very large market demand . As one of the main processing technologies for ultra-thin parts, grinding and polishing technology has the advantages of high processing efficiency, good process controllability, and low surface and sub-surface damage. In the grinding and polishing process of ultra-thin parts, the workpiece needs to be reliably clamped. The existing ultra-thin parts clamping methods mainly include paraffin bonding, water surface tension adsorption, electrosta...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/27
CPCB24B37/27
Inventor 李军王健杰明舜朱永伟左敦稳黄俊阳张羽驰
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS