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Mainframe box structure

A technology of the main chassis and chassis, which is applied in the direction of instruments, electrical digital data processing, digital data processing parts, etc., and can solve problems such as difficult cleaning and easy accumulation of dust on the heat dissipation grill

Inactive Publication Date: 2018-10-09
CHANGZHOU COLLEGE OF INFORMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these cooling grills tend to accumulate dust and are not easy to clean

Method used

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  • Mainframe box structure
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Embodiment Construction

[0019] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0020] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

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Abstract

The invention relates to a mainframe box structure. The mainframe box structure comprises a mainframe structure shell and a baffle set assembly, a containing space is formed in the mainframe box shell, and a heat dissipation fan is arranged in the containing space; multiple wind outlets are formed in one side wall of the mainframe box shell and bestrew the side wall, and the heat dissipation fan is aligned with the wind outlets; the baffle set assembly comprises an upper baffle set plate and a lower baffle set plate, the upper baffle set plate and the lower baffle set plate are rotatably arranged on the top and the bottom of the mainframe box shell respectively, multiple communication holes are formed in the upper baffle set plate and the lower baffle set plate, the communication holes andthe wind outlets are in staggeredly arranged, and glue dusting layers adhere to the inner side of the upper baffle set plate and the inner side of the lower baffle set plate. Dust of the mainframe box structure is easy to clean.

Description

technical field [0001] The invention relates to a main chassis structure. Background technique [0002] As a kind of office equipment, computer is more and more popular in its application. Computers generally have a main box, and various electronic components are arranged in the main box. When in use, various electronic components will emit heat, and in order to realize the heat dissipation of the main chassis. Heat dissipation windows are generally provided on the side walls of the main chassis, and heat dissipation grills are arranged on the heat dissipation windows. However, these cooling grills tend to accumulate dust and are not easy to clean. Contents of the invention [0003] Based on this, it is necessary to provide a main chassis structure that is convenient for cleaning dust. [0004] A main chassis structure, comprising a chassis casing and a retaining assembly, a storage space is formed in the casing casing, a cooling fan is arranged in the storage space, a...

Claims

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Application Information

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IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/18G06F1/20
Inventor 杨丹
Owner CHANGZHOU COLLEGE OF INFORMATION TECH
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