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Apparatus, system and method for picking, placing and melting solder sleeves onto shielded wires and cables

A solder and sleeve technology, applied in the field of wire processing of wire harnesses, can solve problems such as infeasibility of aircraft wiring harnesses

Active Publication Date: 2021-03-16
THE BOEING CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such high standards often render automated wire assembly systems impractical for making aircraft wiring harnesses

Method used

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  • Apparatus, system and method for picking, placing and melting solder sleeves onto shielded wires and cables
  • Apparatus, system and method for picking, placing and melting solder sleeves onto shielded wires and cables
  • Apparatus, system and method for picking, placing and melting solder sleeves onto shielded wires and cables

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Embodiment Construction

[0068] Systems and techniques for wire handling are described in this disclosure according to one or more examples. The wire processing system includes a plurality of processing stations and one or more wire transport devices.

[0069] The systems and techniques described herein allow for improved wire handling in the manufacture of wire harnesses for aircraft applications. The systems and techniques described herein include a plurality of stations that manufacture such wire harnesses by performing one or more discrete steps in the manufacture of such wire harnesses. Examples of these steps include receiving a coil of wire, stripping the wire over a predetermined area, inserting and / or positioning an electrical component over the stripped area, and soldering the electrical component over the stripped area. Some other examples include additional steps in the manufacture of such wire harnesses, such as inserting the wires into the receptacles of the connectors, soldering the wi...

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PUM

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Abstract

The present application relates to apparatus, systems and methods for picking, placing and melting solder sleeves onto shielded wires and cables. Systems and methods for wire handling are provided. In some examples, a wire handling system is disclosed. The wire handling system includes a wire and solder sleeve attachment system. The wire and solder sleeve coupling system includes an end effector configured to retain the solder sleeve and a separation funnel configured to guide insertion of the wire into the solder sleeve, allowing the solder sleeve to The cartridge moves through the separation funnel and prevents movement of the solder sleeve through the separation funnel in the first position. The end effector can additionally be configured to remove the fillet from the wire.

Description

technical field [0001] The present disclosure relates generally to wire handling and more particularly to wire handling, such as for wiring harnesses of aircraft. Background technique [0002] Wiring harnesses, such as those used for aircraft subsystems, generally require high reliability. The production process used to make such wire harnesses utilizes high quality components such as high quality wires, connectors and connectors. Assembly of such high quality components needs to be performed in a repeatable manner that minimizes failures. Such high standards often render automated wire assembly systems impractical for fabricating aircraft wiring harnesses. Contents of the invention [0003] Systems and methods for wire handling are disclosed herein. In some examples, an apparatus is disclosed that facilitates insertion of a wire surrounded by a shielding into a solder sleeve to prevent misalignment of the shielding during insertion. The apparatus includes an end effec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R43/02
CPCH01R43/02H01R43/0263H01R43/0228H01R43/05H01R43/28G05B19/19G05B2219/37582
Inventor E·J·赫尔米克B·J·米切尔
Owner THE BOEING CO