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A Vibration Measurement Method

A vibration measurement and pixel technology, applied in image analysis, image enhancement, instruments, etc., can solve the problem of marking on the surface of the workpiece

Active Publication Date: 2020-08-07
HUNAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in some special working conditions or harsh environments such as high temperature and high pressure, it is difficult for manpower to place marks on the surface of the workpiece

Method used

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Embodiment Construction

[0053] In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0054] It should be noted that "and / or" in the present invention means that both can be available at the same time, and one of them can also be selected, such as scheme A and / or scheme B, including scheme A, scheme B, scheme A and scheme B, etc. three situations.

[0055] Such as Figure 1-8 As shown, a vibration measurement method proposed by the present invention is used for vibration measurement of structures with significant edge features, without the need to lay out cooperation signs in advance. The dynamic measurement of the object to be measured is re...

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Abstract

The invention discloses a vibration measurement method which comprises the steps of performing dynamic continuous shooting on an object to be measured through a stereoscopic camera station system comprising two cameras, performing denoising treatment on a shot image, performing threshold division on the denoised image to form a binary image, performing coarse positioning of the object edge on thebinary image, acquiring a pixel skeleton of the object edge, determining a starting point and a tail endpoint of the pixel skeleton of the object edge as virtual target points, acquiring pixel skeletons of the images shot continuously, performing dynamic tracing and matching on the virtual target points, performing system standardization on the stereoscopic camera station system to form internal and external parameters of the stereoscopic camera station system, and calculating space vibration response of the virtual target points. According to the vibration measurement method, vibration measurement can be achieved with no need for pasting or arranging a mark on the object to be measured in advance; the pollution and damage of a structure surface are not caused; the method is particularly applicable to high-temperature and high-pressure occasions where the mark is difficultly arranged manually under a special working condition; and manpower and material resources are greatly saved.

Description

technical field [0001] The present invention relates to the technical field of digital close-range photogrammetry, in particular to a vibration measurement method, especially a marker-free vibration measurement method based on structure edge sub-pixel skeleton extraction, which is suitable for structures or objects with significant edge features dynamic measurement. Background technique [0002] Most traditional modal tests use acceleration, velocity or displacement sensors to obtain vibration responses. One sensor can only obtain the response output of a single point in a specific direction. For intensive space sampling, it is necessary to install multiple sensors, which is prone to installation and wiring difficulties and test efficiency. Low and additional quality issues. [0003] Thin-walled structures generally refer to structures composed of thin plates, thin shells and slender rods, which can bear large loads with less weight and less material, and contain significan...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01C11/02G01C11/04G06T7/246G06T7/11G06T5/00
CPCG01C11/02G01C11/04G06T5/002G06T7/11G06T7/246
Inventor 王文韫陈安华李学军胡小平
Owner HUNAN UNIV OF SCI & TECH
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