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Apparatus and method for simulating temperature during thermal curing cycle

A technology of heat curing and equipment, applied in the application of thermometers, parts of thermometers, thermometers with direct heat-sensitive electric/magnetic components, etc.

Active Publication Date: 2021-11-02
THE BOEING CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Temperature sensors placed in the thermal mass may have limited application, for example, due to composite structure and / or forming tool geometry and / or materials and gas velocity and direction within the autoclave or oven

Method used

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  • Apparatus and method for simulating temperature during thermal curing cycle
  • Apparatus and method for simulating temperature during thermal curing cycle
  • Apparatus and method for simulating temperature during thermal curing cycle

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example

[0150] refer to Figure 17 , flowchart 500 depicts an example method for controlling heat transfer during simulation of an article subjected to a heating cycle, for example, control to temperature simulation component 104 of disclosed apparatus 100 that simulates a composite structure during a heat curing cycle. heat transfer. At block 502, the method begins by constructing the device 100 by arranging the housing assembly 102 and the temperature simulation assembly 104 to achieve a thermal response of the device 100 that replicates the thermal response of a particular composite structure, e.g., as described above and Figure 16 illustrated in. At block 504 , the temperature simulation assembly 104 is thermally isolated from the environment by the housing assembly 102 . At block 506, the device 100 is heated during a heat curing cycle, eg, within a heat curing system.

[0151] At block 508 , conductive heat transfer to the temperature simulation assembly 104 of the device 10...

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Abstract

The subject of the present invention is a device and a method for simulating temperature during a thermal curing cycle. The apparatus includes a housing assembly including a housing assembly-front end and an opposing housing assembly-rear end; and a temperature simulation assembly mounted within the housing assembly and including a temperature simulation assembly-front end positioned proximate to the housing assembly-front end and a temperature simulation assembly-rear end spaced apart from the housing assembly-rear end. The housing assembly thermally isolates the temperature simulation assembly. The housing assembly allows only conductive heat transfer through the housing assembly-front to the temperature simulation assembly.

Description

technical field [0001] The present disclosure relates generally to the fabrication of composite structures, and more particularly to apparatus and methods for simulating the temperature of composite structures and / or forming tools throughout a thermal cure cycle. Background technique [0002] Thermal curing of a composite refers to the toughening or hardening of the polymer matrix material of the composite by cross-linking of the polymer chains brought about by the application of heat and optionally pressure, for example using an autoclave or an oven. One of the main goals of the thermal curing process is to fully cure the thermoset polymer matrix material (eg, resin) by initiating and sustaining specific chemical reactions. [0003] Typically, a composite structure is assumed to have achieved full cure when certain specified time and temperature targets are achieved. To achieve this goal, various process parameters (eg, time and temperature within the autoclave or oven) ar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C70/54
CPCB29C70/54B29C35/0288B29C35/0294G01K7/427G01K2007/422B29C2037/90G01K1/08G01K1/16G01K3/14G01K13/10G01K2213/00
Inventor J·M·格里菲思G·E·比伯S·M·史彻科S·J·普鲁玛R·M·特雷拉R·J·拜因顿
Owner THE BOEING CO