Apparatus and method for simulating temperature during thermal curing cycle
A technology of heat curing and equipment, applied in the application of thermometers, parts of thermometers, thermometers with direct heat-sensitive electric/magnetic components, etc.
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[0150] refer to Figure 17 , flowchart 500 depicts an example method for controlling heat transfer during simulation of an article subjected to a heating cycle, for example, control to temperature simulation component 104 of disclosed apparatus 100 that simulates a composite structure during a heat curing cycle. heat transfer. At block 502, the method begins by constructing the device 100 by arranging the housing assembly 102 and the temperature simulation assembly 104 to achieve a thermal response of the device 100 that replicates the thermal response of a particular composite structure, e.g., as described above and Figure 16 illustrated in. At block 504 , the temperature simulation assembly 104 is thermally isolated from the environment by the housing assembly 102 . At block 506, the device 100 is heated during a heat curing cycle, eg, within a heat curing system.
[0151] At block 508 , conductive heat transfer to the temperature simulation assembly 104 of the device 10...
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