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A vacuum pumping device and a vacuum pumping method

一种抽真空装置、抽真空的技术，应用在电气元件、电路、半导体/固态器件制造等方向，能够解决基片翘曲翘曲等问题

Active Publication Date: 2021-05-28
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of this, the object of the present invention is to provide a vacuum pumping device and a vacuum pumping method to solve the problem of substrate warping during the vacuum pumping process of substrate bonding

Method used

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  • A vacuum pumping device and a vacuum pumping method
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  • A vacuum pumping device and a vacuum pumping method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] refer to image 3 , the present embodiment provides a vacuuming device, including: a vacuum chamber 14, a bonding fixture 13, and a vacuuming system (including a first vacuuming circuit 00 and a second vacuuming circuit 01); the vacuuming system is used for The vacuum chamber 14 is evacuated into a vacuum environment. The vacuum chamber 14 has a supporting platform 11 and an extrusion platform 12 above the supporting platform 11 , and the bonding fixture 13 is located on the supporting platform 11 in the vacuum chamber 14 .

[0051] The bonding jig 13 can be as Figure 1 ~ Figure 2 The bonding fixture 0 in the middle includes: a substrate stage 6, a fixture frame 5, a pressing block 4, and a spacer 3. When the substrate is clamped, the lower substrate 1 is placed on the substrate stage 6 with a groove 7. On the top, the upper substrate 2 is located above the lower substrate 1 and is separated by a spacer 3 at a certain distance. Wherein, the groove 7 is used for abso...

Embodiment 2

[0069] refer to Figure 4 , the present embodiment provides a vacuum pumping device, and the difference from the first embodiment is that the third vacuum pump 16 in the first embodiment is a dry pump, while the third vacuum pump 18 in the present embodiment is an air pump or other vacuum pumps with less power , so as to reduce the volume, the occupied space is also reduced, and the cost is reduced; and a third valve 19 is added, and the first vacuum circuit 00 and the second vacuum circuit 01 are communicated through the third valve 19, and the third valve 19 can Control the on-off of the first vacuum circuit 00 and the second vacuum circuit 01. The first end of the third valve 19 communicates with the primary vacuum pipeline, and the second end of the third valve 19 communicates with the second vacuum pipeline.

[0070] Wherein, the maximum vacuuming value of the third vacuum pump 18 ranges from 2400Pa to 2600Pa. It can be seen that its vacuuming capacity is significantly ...

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PUM

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Abstract

The invention provides a vacuum pumping device and a vacuum pumping method, which are used to provide a vacuum environment for substrate bonding. The vacuum pumping device includes: a vacuum chamber, a bonding fixture, and a vacuum pumping system; the bonding fixture is located at In the vacuum chamber, the bonding fixture includes a substrate stage, and the substrate stage has a groove for absorbing the substrate; the vacuum chamber and the groove are both communicated with the vacuum pumping system ; During the vacuuming process of the vacuum pumping system, make the vacuum value in the groove less than or equal to the vacuum value of the vacuum cavity. In the vacuuming device and the vacuuming method provided by the present invention, the groove and the vacuum chamber on the substrate table are vacuumed by using the vacuuming system, and the vacuum value of the groove is always less than or equal to the vacuum value of the vacuum chamber, so that The substrate on the substrate stage is always firmly attached to the substrate stage without warping, thereby improving the bonding quality of the substrate.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a vacuuming device and a vacuuming method. Background technique [0002] In current semiconductor processes, there are often technologies that combine two identical or different materials. This technique is called bonding technique. Generally, two wafers, two glasses, or a glass and a wafer need to be bonded. For the convenience of description, the wafers and glasses to be bonded are collectively referred to as substrates. Substrate bonding is an important process in the three-dimensional processing of semiconductor devices, and it is used in both the front-end process and the back-end process of device manufacturing. [0003] The main steps of the current substrate bonding process include substrate surface treatment, substrate alignment, and final substrate bonding. The main process of the final substrate bonding is: placing the bonding fixture that has completed the s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/18H01L21/67
CPCH01L21/187H01L21/67005H01L21/67155H01L21/68728H01L21/6838H01L21/67092H01L21/67017H01L21/67242H01L21/68785
Inventor 余远根霍志军赵滨付辉王星星
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD