Unlock instant, AI-driven research and patent intelligence for your innovation.

Wafer chuck and working method thereof

A technology of wafers and chucks, applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problem that the position of circuit components is not easy to determine, and achieve the effect of reducing movement

Pending Publication Date: 2018-11-06
SKYVERSE TECH CO LTD
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the prior art, when the wafer is fixed on the wafer chuck, the position of the circuit components in the wafer is not easy to determine

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer chuck and working method thereof
  • Wafer chuck and working method thereof
  • Wafer chuck and working method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] There are many problems with the wafer chuck, for example, the wafer chuck cannot locate the semiconductor structure in the wafer.

[0038] Now combine a wafer chuck to analyze the reason why the existing wafer chuck is not easy to locate the semiconductor structure in the wafer during use:

[0039] The method for fixing a wafer by a wafer chuck includes: providing a wafer, the wafer includes a contact surface; providing a wafer chuck, the wafer chuck includes an adsorption surface; making the wafer contact surface and the wafer chuck Adhesive surface fit.

[0040] Wherein, the wafer contact surface is circular, and the adsorption surface is also circular. In the process of attaching the contact surface of the wafer to the suction surface of the wafer chuck, the center of the suction surface can coincide with the center of the contact surface, but the wafer can rotate around the center of the suction surface, so that the wafer cannot be determined. The position of the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a wafer chuck and a working method thereof, wherein the wafer chuck comprises: a chuck body and a first positioning member connecting the chuck body, wherein the chuck body comprises an adsorption surface that is used for adsorbing a wafer, the sidewall of the wafer has a notch, and the first positioning member is used for positioning the notch of the wafer. The wafer chuckis capable of determining the relative positional relationship between the semiconductor structure and the adsorption surface in the wafer, thereby facilitating processing and detection of the wafer.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a wafer chuck and a working method thereof. Background technique [0002] In semiconductor technology, it is often necessary to form circuit elements in a wafer, and in order to determine the relative position of the circuit element and the wafer, the sidewall of the wafer has notches. During wafer processing or testing, it is often necessary to fix the wafer on the processing device, so as to facilitate the processing of the wafer. [0003] In the existing semiconductor processing technology, there are mainly three ways to fix the wafer: first, the wafer is clamped by the clamping head to fix the wafer; second, the wafer is fixed on the processing surface through electrostatic adsorption. on the device; thirdly, the wafer is fixed by vacuum adsorption. Among them, the way of vacuum adsorption can make the force on the wafer uniform, not easy to damage the wafer...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6831H01L21/6838
Inventor 张朝前马砚忠李少雷陈鲁
Owner SKYVERSE TECH CO LTD