White light LED packaging structure and packaging method

A technology of LED packaging and LED chips, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of low luminous efficiency and poor stability of quantum dot white LEDs, and achieve stable visual effects, narrow half-peak width, and good visual effects. Effect

Active Publication Date: 2018-11-06
NANCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a white light LED packaging structure and packaging method, which can effectively solve the technical problems of low luminous efficiency and poor stability of existing quantum dot white light LEDs

Method used

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  • White light LED packaging structure and packaging method
  • White light LED packaging structure and packaging method
  • White light LED packaging structure and packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Fix the blue LED chip on the packaging base, set a light-transmitting carrier in the packaging base and above the blue LED chip; prepare multi-color quantum dots, and use the thermal injection method to synthesize cesium stearate and oleic acid cesium oleate All-inorganic perovskite quantum dots CsPb(Br x I 1-x ) 3 , in which red x=0.42, yellow x=0.6, green x=1, the synthesized quantum dots are centrifuged, using cyclohexane as solvent, solid-liquid ratio is 1:2 (ml / mg), and dispersed by ultrasonic for 10s Dissolve; spin-coat red, yellow, and green quantum dots sequentially on the transparent carrier through vertical layering, absorb 0.01ml of spin-coating on the transparent carrier respectively, the rotation speed is 800rpm, and the number of spin-coating times is 2 times. Atomic layer deposition of alumina is used for isolation and protection. Trimethylaluminum and oxygen are used as raw materials. The power of the equipment is 45W. film. Finally, polysiloxane enc...

Embodiment 2

[0047] Fix the blue LED chip on the packaging base, set a light-transmitting carrier in the packaging base and above the blue LED chip; prepare multi-color quantum dots, and use the thermal injection method to synthesize cesium stearate and oleic acid cesium oleate All-inorganic perovskite quantum dots CsPb(Br x I 1-x ) 3 , where red x=0.45, yellow x=0.58, and green x=1. The synthesized quantum dots were centrifuged, and cyclohexane was used as a solvent with a solid-liquid ratio of 1:1. They were completely dissolved by ultrasonic dispersion for 10 seconds; Layers were spin-coated with red, yellow, and green quantum dots sequentially on the transparent carrier, respectively absorbing 0.01ml of spin coating on the transparent carrier, the rotation speed was 800rpm, and the number of spin coatings was 2 times. For isolation protection, trimethylaluminum and oxygen are used as raw materials, and the power of the equipment is 45W. They are alternately fed into the reaction cham...

Embodiment 3

[0049] Fix the blue LED chip on the packaging base, and set a light-transmitting carrier in the packaging base and above the blue LED chip; prepare multi-color quantum dots and use cesium stearate and oleic acid to synthesize cesium oleate quickly Injected into a mixed solution of oleic acid, oleylamine, lead bromide (or lead iodide), and octadecene to synthesize all-inorganic perovskite quantum dots CsPb(Br x I 1-x ) 3 , where red x=0.42, yellow x=0.6, green x=1, the synthesized quantum dots were centrifuged, and cyclohexane was used as solvent with a solid-liquid ratio of 1:2, and they were completely dissolved by ultrasonic dispersion for 10s; The red, yellow, and green quantum dots were sequentially spin-coated on the transparent carrier, and 0.01ml of the spin-coating was absorbed on the transparent carrier, the rotation speed was 700rpm, and the number of spin-coating times was 3 times. For isolation protection, trimethylaluminum and oxygen are used as raw materials, a...

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Abstract

The invention discloses a white light LED packaging structure and packaging method. The packaging structure comprises a blue light LED chip, a packaging substrate, a light-transmitting carrier, a multilayer-color quantum dot coating layer and a polysiloxane packaging layer, wherein the packaging substrate is used for fixing the blue light LED chip; the packaging substrate comprises a base and a surrounding baffle arranged on the periphery of the base; the blue light LED chip is fixed on the base; the light-transmitting carrier is arranged in the packaging substrate and above the blue light LEDchip; the multilayer-color quantum dot coating layer is arranged on the surface of the light-transmitting carrier; and the polysiloxane packaging layer is arranged on the surface of a protection layer. By virtue of the packaging structure, multi-color quantum dots are mixed to form a warm white light LED which is low in color temperature, high in visual effect and stable.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a white light LED packaging structure and packaging method. Background technique [0002] As a new type of light source, LED (Light Emitting Diode) solid-state light source has the advantages of small size, low energy consumption, long life, and high luminous efficiency. It is conducive to the manufacture of integrated display devices, and has good visual effects, environmental protection and energy saving. Therefore, LED solid-state light sources are regarded as the next generation of conventional lighting sources. With the breakthrough of solid-state lighting technology, high-brightness warm white lighting has great commercial prospects. [0003] At present, white LEDs are mostly cool white light with high color temperature, and there are corresponding problems due to inherent properties or technical difficulties. At present, the most widely used method is to convert wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50
Inventor 刘虎王立章少华何沅丹何海洋林凯茜
Owner NANCHANG UNIV
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