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Notebook computer bottom plate shell with rapid heat dissipation structure and precision mold thereof

A notebook computer and heat dissipation structure technology, applied in the directions of forming tools, manufacturing tools, cleaning methods and utensils, etc., can solve the problems of inability to clean the lower mold cavity, reduce production efficiency, lack of lower mold cavity cleaning devices, etc. Work efficiency and product yield, the effect of ensuring yield and quality

Pending Publication Date: 2018-11-16
太仓市众翔精密五金有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the mold of the notebook computer shell usually lacks the cavity cleaning device of the lower mold, which cannot directly clean the cavity of the lower mold, and needs to be cleaned manually, which is very troublesome and reduces production efficiency

Method used

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  • Notebook computer bottom plate shell with rapid heat dissipation structure and precision mold thereof
  • Notebook computer bottom plate shell with rapid heat dissipation structure and precision mold thereof
  • Notebook computer bottom plate shell with rapid heat dissipation structure and precision mold thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Such as figure 1 As shown, a notebook computer chassis with a rapid heat dissipation structure includes a chassis body 5, a first heat dissipation punch hole 51, a second heat dissipation punch hole 52, a clamping slot 54 and a supporting bottom pad 53. The bottom chassis body 5 It is stamped and formed by a stamping die. The bottom shell body 5 has a square structure and is provided with a plurality of first heat dissipation punching holes 51 and second heat dissipation punching holes 52. The first heat dissipation punching holes 51 are arranged in a matrix and arranged on the At the middle position of the upper end of the bottom shell body 5, the second heat dissipation punching hole 52 is a waist-shaped hole structure and is arranged on both sides of the lower end of the bottom shell body 5; the clamping groove 54 is located at the upper end of the bottom shell body 5 Setting, the support bottom pad 53 is made of rubber material and is set close to the four corners o...

Embodiment 2

[0030] Such as figure 2 and 4 As shown, as an embodiment of the present invention, a notebook computer bottom shell and a precision mold with a rapid heat dissipation structure include an upper mold 1, a lower mold 2 and a pushing mechanism 3, and the bottom end of the upper mold 1 is provided with an upper mold convex head 11. The middle of the upper end of the lower die 2 is provided with a lower die cavity 21 matching the upper die protrusion 11, and the lower die 2 is symmetrically provided with slide grooves 22 on both sides of the lower die die cavity 21 , the chute 22 is provided with a limit baffle 7 close to the cavity 21 of the lower mold; the push mechanism 3 includes a connecting ear 31, a telescopic rod 32, a telescopic sleeve 33, a telescopic spring (not shown), a slide rod 34. Sliding plate 35 and cleaning brush 36, the sliding plate 34 is located at the bottom end of the chute 22, the bottom end of the sliding plate 35 is provided with a cleaning brush 36, an...

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PUM

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Abstract

The invention relates to a notebook computer bottom plate shell with a rapid heat dissipation structure and a precision mold thereof. Sliding grooves are formed in both sides of the interior of a lower mold body, and sliding plates and cleaning brushes are arranged at the bottom end of the sliding grooves. Since telescopic rods are arranged at an acute angle when the mold is closed, when an uppermold body moves upwards for mold opening, the telescopic rods are driven to move upwards and apply acting force to sliding bars for moving of the sliding bars towards the mold cavity direction. The sliding bars move towards the mold cavity direction under the action of the acting force, and the sliding bars further push the sliding plates and the cleaning brushes to move along the interiors of thesliding grooves towards the mold cavity direction. When the proper position is reached, a molded product in a mold cavity is taken out, upward movement is continued, the cleaning brushes continue tomove laterally into a lower mold body cavity for cleaning the interior of the lower mold body cavity, and finally debris is pushed to a debris discharging hole and through holes to be discharged so asto ensure the cleanness of the lower mold body cavity; and when the upper mold body is closed, the structure is pushed to perform reverse movement to be back to the initial position to automaticallyclean debris in the lower mold body cavity, and the work efficiency and the product yield are improved.

Description

technical field [0001] The invention relates to the technical field of notebook computer chassis molds, in particular to a notebook computer chassis and a precision mold with a rapid heat dissipation structure. Background technique [0002] Molds include injection molds, stamping molds, etc. Notebook computer molds have become diversified with the gradual popularization of notebook computers. Different types of molds should be developed for different parts, and different types of molds have an impact on the pass rate of products. [0003] In the prior art, the mold of the notebook computer shell usually lacks a lower mold cavity cleaning device, which cannot directly clean the cavity of the lower mold, and needs to be cleaned manually, which is very troublesome and also reduces production efficiency. Contents of the invention [0004] In order to solve the above-mentioned existing problems, the object of the present invention is to provide a notebook computer bottom plate ...

Claims

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Application Information

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IPC IPC(8): B21D37/10B21D37/12B21D45/08B08B1/00G06F1/18
CPCG06F1/181B21D37/10B21D37/12B21D45/08B08B1/30B08B1/12
Inventor 罗建荣
Owner 太仓市众翔精密五金有限公司