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Modular thin film for floor heating and floor heating mounting method applying same

A modular and thin-film technology, applied in the field of heating, can solve problems such as increased installation costs and complex structures, and achieve the effects of preventing heat damage, ensuring comprehensiveness, and avoiding heat loss

Pending Publication Date: 2018-11-16
叶冬
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented describes an improved type of membrane called Modular Film (MF). These Membranes have better properties than previous types like Platelet) because they use less expensive materials instead of regular ones such as foam boards. They allow for easier assembly without having to worry about maintaining their original shape after being installed. Additionally, these MOF's consist mainly of PolyPropylenetriol (PPyT), which helps prevent damage caused by too much heat while still allowing enough space inside them to absorb more energy compared to other alternatives. Overall, this new technology allows for efficient utilization of resources within buildings while improving safety standards.

Problems solved by technology

This patented technical problem addressed by this patents relating to building up an improved floor system involves efficiently installing floor heatings without increasing their overall size while maintaining good quality control over room temperatures during construction. Current methods require multiple layers of material such as sandwiched metal sheets, foam wrap, etc., making them difficult to work around irregular surfaces like curved walls. Additionally, there may be issues where the installed lines cracks under heavy loads caused by gravity flow.

Method used

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  • Modular thin film for floor heating and floor heating mounting method applying same
  • Modular thin film for floor heating and floor heating mounting method applying same
  • Modular thin film for floor heating and floor heating mounting method applying same

Examples

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Effect test

Embodiment 1

[0043] Such as figure 1 and 3 As shown, a modular film for floor heating, the modular film includes several groups of film structures, the film structure includes an upper raised array 2, the upper raised array 2 includes several groups of raised rows, each A cable installation area 4 for installing heating cables 3 is formed between the two groups of raised rows. After the heating cables pass through the cable installation area, they are fixed on the raised rows. Several protruding structures 21 are arranged on it, and the protruding structures 21 are formed by plastic extrusion and hot pressing.

[0044] The film structure of this embodiment is a double-layer film structure, and the double-layer film structure includes a lower layer film 1 and an upper layer protrusion array 2, and the upper layer protrusion array 2 is fixed on the bottom layer of the lower layer film 1 by thermal bonding. On the upper surface, the upper protrusion array 2 includes several groups of protru...

Embodiment 2

[0054] Such as figure 2 As shown, this embodiment only describes the difference from the above embodiment, and the rest of the technical features are the same as the above embodiment. The upper-layer protrusion array 2 of this embodiment distributes several groups of protrusion rows at intervals along the center of the lower film 1 to the surroundings, and each group of protrusion rows takes the center of the lower film 1 as the center to form a circle. Shaped distribution, an annular cable installation area 4 is formed between every two groups of the raised rows. The upper convex array 2 forms a ring-shaped array, and the heating cable 3 is gradually laid in the ring-shaped cable installation area 4 from the center of the lower film 1 to the surroundings. Compared with the polygonal array with the same area, the ring-shaped cable installation area 4 will increase. The laying overall length of heating cable 3 improves calorific value.

Embodiment 3

[0056] This embodiment only describes the difference from the above embodiment, and other technical features are the same as the above embodiment. In this embodiment, an adhesive is added in the cavity 211, and the amount of the adhesive added is greater than the size of the cavity 211. When the connection between the raised structure 21 and the ceramic tile or wooden floor becomes loose and degummed Increase the heat of the heating cable 3 to cause the adhesive in the cavity 211 to expand and melt to overflow from the cavity 211. The overflowing adhesive can continue to connect the raised structure 21 and the ceramic tile or wooden floor to ensure that the two do not There will be separation.

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PUM

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Abstract

The invention discloses a modular thin film for floor heating and a floor heating mounting method applying the same. The modular thin film comprises a plurality of sets of double-layer thin film structures which comprise lower-layer thin film bodies and upper-layer bulge arrays; the upper-layer bulge arrays are fixed to the upper surface of the lower-layer thin film bodies in a heat bonding mode and comprise a plurality of sets of bulge rows; a cable mounting area used for mounting heating cables is formed between every two sets of bulge rows; the heating cables penetrate through the cable mounting areas and then are wound on the bulge rows to be fixed; and a plurality of bulged structures are arranged at the edges of each set of bulge row, and the bulged structures are formed by plastic coiled materials which are extruded and then hot-pressed. The modular thin film is manufactured through plastic with the low thermal conductivity and the high melting point at the same time, the mounting speed is increased, the mounting materials are reduced, the overall mounting layer thickness is decreased, the risk that floor tiles are broken or floor gaps become large is lowered, the uniform compression performance of the floor tiles and a floor bottom layer is improved, and the shape of the mounting ground is not limited.

Description

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Claims

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Application Information

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Owner 叶冬