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Method for bonding two substrates

A combination, base-based technology, applied in the direction of bonding methods, bonding methods of adhesive heating, chemical instruments and methods, etc., can solve problems such as poor bonding performance

Inactive Publication Date: 2018-11-27
威亚光电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, after the adhesive has been applied to the first substrate, the adhesion to the second substrate is often poor

Method used

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  • Method for bonding two substrates
  • Method for bonding two substrates
  • Method for bonding two substrates

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Embodiment Construction

[0041] The method for joining the two substrates 1, 2 is described below. The first substrate 1 is in particular a non-sensitive substrate. Substrates made of glass or plastic are known as insensitive substrates. The insensitive substrate can be a cover or a touch screen (touch sensor). Insensitive here means that increased pressure or temperature during the process or uneven pressure does not change the properties of the substrate after the process. An insensitive substrate is thus an insensitive substrate.

[0042] The first substrate 1 in particular has a substantially planar / planar surface. The base 1 has in particular two opposite, planar, parallel surfaces. Functional layers such as ITO or similar can be embedded in the substrate, or design elements such as color printing can be present on the surface.

[0043] The second substrate 2 is especially a sensitive substrate. In particular display devices (displays) are referred to as sensitive substrates. The display d...

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Abstract

The present invention relates to a method for bonding two substrates (1,2). The method comprises the following steps of applying a bonding agent (4) to a first substrate (1); hardening a part of the bonding agent (4); applying a second substrate (2) to the bonding agent (4), wherein the second substrate (2) is applied to the bonding agent (4) before the bonding agent is hardened totally.

Description

[0001] This application is a divisional application of the patent application No. 201310573093.2, the filing date of the original application is November 15, 2013, and the title of the invention is "Method for combining two substrates". technical field [0002] The invention relates to a method for joining two substrates / substrates. The invention also relates to an intermediate product in the manufacture of a display device and a display device. Background technique [0003] It is known from the prior art to use UV-curing adhesives for joining two optical substrates. Here, the two substrates to be connected to one another are pressed together with the adhesive. Here, pressure points may form. Furthermore, after the adhesive has been applied to the first substrate, the adhesion properties to the second substrate often deteriorate. This will also be prevented by the method described. Contents of the invention [0004] The object of the invention is to improve the method ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J5/00G02F1/1333
CPCC09J5/06G09F9/30B32B37/12C09J5/00G02F1/1339G09F9/00
Inventor J·艾希纳
Owner 威亚光电子有限公司