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Flexible bionic electronic skin and its preparation method

An electronic skin and flexible technology, applied in the field of sensors and bionics, can solve the problems of no pressure sensing and airflow sensing functions, complex preparation methods of conductive films, etc., and achieve the effects of low cost, high sensitivity, and simple processing methods.

Active Publication Date: 2019-05-21
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the preparation method of the conductive film is complicated, and it does not have the sensory function of feeling pressure and airflow

Method used

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  • Flexible bionic electronic skin and its preparation method
  • Flexible bionic electronic skin and its preparation method
  • Flexible bionic electronic skin and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0047] In the first embodiment of the present invention, a flexible bionic electronic skin is provided. Such as figure 1 As shown, the flexible bionic electronic skin includes:

[0048] piezoresistive layer 1;

[0049] Thin film electrode 3;

[0050] The piezoresistive layer 1 at least partially has a porous structure,

[0051] The piezoresistive layer 1 is in contact with the thin film electrode 3, and,

[0052] In the piezoresistive layer 1 in the contact interface area between the piezoresistive layer 1 and the thin film electrode 3, there is at least partially a filling area 2, and the filling area 2 contains an elastomer; wherein,

[0053] The resistance value of the piezoresistive layer 1 is detected by the thin-film electrode 3, and the force on the flexible bionic electronic skin is determined according to the detection result. Wherein, the received force may be the force generated by the gas flow above the flexible bionic electronic skin, or the force exerted by...

no. 2 approach

[0088]The second embodiment of the present invention provides a method for preparing a flexible bionic electronic skin. The method comprises the steps of:

[0089] The step of connecting the piezoresistive layer 1 with the thin film electrode 3;

[0090] A step of forming a filling region 2 on one side of the piezoresistive layer 1;

[0091] Wherein, the filled region 2 on one side of the piezoresistive layer 1 is adjacent to the thin film electrode 3,

[0092] The piezoresistive layer 1 at least partially has a porous structure, and the filled region 2 contains elastomer.

[0093] Typically, the preparation method of the present invention can be carried out according to the following steps:

[0094] Connecting the piezoresistive layer 1 to the film electrode 3, pouring an elastomer solution on at least a part of the junction between the piezoresistive layer 1 and the film electrode 3, so that a part of the piezoresistive layer 1 is infiltrated by the elastomer solution, f...

Embodiment 1

[0113] In this embodiment, a three-dimensional carbon nanofiber material is firstly prepared as a piezoresistive layer, and then ecoflex30 is used as a raw material of an elastomer, and a carbon nanotube film electrode is selected as a film electrode. Concrete preparation steps are as follows:

[0114] (1) Dissolve polyacrylonitrile in N,N dimethylformamide solvent, and stir at 60°C for 5 hours; wherein the mass percentage of polyacrylonitrile is 16wt.%. Quality anhydrous aluminum chloride, make the mass percentage of anhydrous aluminum chloride in the electrospinning base solution be 2wt.%, stir at 60°C for 5 hours, then stand at 25°C for 1 hour to obtain the electrospinning Solution; the voltage is 13kV, the inner diameter of the needle is 0.8mm, the volume of the spinning liquid is 7mL, the advancing speed of the spinning liquid is 0.3ml / h, the distance between the receiving drum and the spinneret is 25cm, the speed of the receiving drum is 200rpm, the air The relative hum...

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Abstract

The invention provides flexible bionic electronic skin and a preparation method thereof. The flexible bionic electronic skin comprises a piezoresistance layer and a thin film electrode, wherein the piezoresistance layer is at least partially provided with a porous structure; the piezoresistance layer is in contact with the thin film electrode; the piezoresistance layer in the contact interface region of the piezoresistance layer and the thin film electrode is at least partially provided with a filling region; an elastic body is contained in the filling region; the resistance value of the piezoresistance layer is detected through the thin film electrode; the intensity of the received force of the flexible bionic electronic skin is determined according to the detecting result. The flexible bionic electronic skin can feel the existence of airflow and pressure; the structure is ingenious; the sensitivity is high; the flexible bionic electronic skin has certain mechanical stability.

Description

technical field [0001] The invention relates to a flexible bionic electronic skin and a preparation method thereof, belonging to the technical field of sensors and bionics. Background technique [0002] As the largest organ of the human body, the skin covers the whole body of the human body and can sense the external environment (such as temperature, pressure, etc.) All are developing rapidly, and bionic electronic skin has also emerged as the times require, making the functions of prosthetics or robots closer to the functions of the human body itself, which can help those with physical defects to improve their lives better. [0003] Most of the electronic skins in the prior art only have the characteristics of sensing pressure or temperature, and the processing technology is complicated and the cost is high, so it is not suitable for large-scale industrial production. In addition, the prepared electronic skin has poor flexibility and does not have the sensory function of f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/22G01L9/04A61L27/60
CPCA61L27/60G01L1/22G01L9/04
Inventor 冯雪韩志远马寅佶陈颖
Owner TSINGHUA UNIV
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