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Off-line full-automatic marking facility

A fully automatic and marking technology, which is applied in welding equipment, laser welding equipment, metal processing equipment, etc., can solve the problems of automatic positioning of PCB, the fixing effect cannot meet the use requirements, high cost, and poor adsorption force, etc., to achieve improved Finished product marking effect, high degree of automation, and effect of improving smoothness

Pending Publication Date: 2018-12-18
昆山卓研智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing PCB marking equipment generally adopts a semi-automatic processing method, which needs to be assisted by manual online operation. The main reason is that the automatic positioning and fixing effect of PCB cannot meet the requirements of use, and some vacuum adsorption platforms are likely to cause board edge warping and poor adsorption force, etc. However, some platforms with pressurization devices are integrated with high cost and complexity, which puts forward high requirements for control accuracy.

Method used

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  • Off-line full-automatic marking facility
  • Off-line full-automatic marking facility
  • Off-line full-automatic marking facility

Examples

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Embodiment Construction

[0027] The technical solutions of the present invention will be further described below in conjunction with the drawings and specific implementations.

[0028] See Figure 1 to 10 As shown, this embodiment provides an offline full-automatic marking device, which mainly includes a structural frame 1 and a loading zone 2, an adsorption zone 3, a marking zone 4, and a discharge zone 5 formed.

[0029] The loading area 2 and the unloading area 5 are respectively provided with movable material carts 6, which are respectively used to hold unmarked products and marked finished products.

[0030] The loading zone 2, the marking zone 4, and the unloading zone 5 are respectively located on the relatively left, upper and right sides of the adsorption zone 3. The structural frame 1 is provided with a first guide rail 101 communicating with the adsorption zone 3 and the marking zone 4. And the second guide rail 102 that connects the loading zone 2, the adsorption zone 3 and the unloading zone 5 ...

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Abstract

The invention discloses an off-line full-automatic marking facility. The off-line full-automatic marking facility comprises a structural frame, a feeding region, an absorption region, a marking regionand a discharging region, wherein the feeding region, the absorption region, the marking region and the discharging region are formed. The feeding region, the marking region and the discharging region are relatively located on the left side, the upper side and the right side of the absorption region correspondingly. A first guide rail which communicates with the absorption region and the markingregion and a second guide rail which communicates with the feeding region, the absorption region and the discharging region in sequence are arranged on the structural frame. An absorption platform iserected on the first guide rail in a sliding mode. Material transfer arms are arranged on the second guide rail in a sliding mode, the material transfer arms and the absorption platform are connectedin a butt joint mode in the absorption region, and a marking head is arranged in the marking region. According to the off-line full-automatic marking facility, the full-automatic production mode is adopted, the structure is reasonably arranged, the feeding region, the absorption region, the marking region and the discharging region are arranged in a T-shaped mode, and therefore the production efficiency is improved. Especially, the absorption platform in the absorption region adopts the mode of combination of vacuum absorption and press plate flattening operation, and therefore the product flatness degree is improved, and then the marking effect of a finished product is improved.

Description

Technical field [0001] The invention relates to the technical field of PCB marking equipment, in particular to an offline automatic marking equipment. Background technique [0002] In the PCB manufacturing process, it needs to be marked to identify its model. Whether it is mechanical imprinting, ink jet coding, or laser engraving, it is necessary to ensure that the PCB is reliably fixed and positioned. The existing PCB marking equipment generally adopts a semi-automatic processing method and requires manual online assistance. The main reason is that the automatic positioning and fixing effect of the PCB does not meet the requirements of use. Some vacuum adsorption platforms may easily cause the edge of the board to rise, poor adsorption, etc. Circumstances, and some platforms equipped with pressurizing devices have high cost and complexity after integration, which places high requirements on control accuracy. Therefore, the overall space occupied by the equipment, structural co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/362B23K26/70B41J2/01B41J3/407
CPCB23K26/361B23K26/702B41J2/01B41J3/407
Inventor 包贤经
Owner 昆山卓研智能科技有限公司
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