Down folding type runner removal device for automated packaging system

Abstract

The invention provides a down folding type runner removal device for an automated packaging system. The down folding type runner removal device comprises a concave die mechanism and a convex die mechanism, wherein the concave die mechanism comprises two first frames, two second frames, two concave dies, two first concave die locking blocks, two second concave die locking blocks, a fixed plate anda plurality of springs; the convex die mechanism comprises a main frame and CULL adsorption mechanism and two convex die folding mechanisms; the main frame and CULL adsorption mechanism comprises fourconvex die locking blocks, two internal storage limiting blocks, a substrate, two CULL linear bearings, two punching plates, a CULL pressing plate and a plurality of suction cups; and each convex diefolding mechanism comprises a pressing plate, a linear guide rail, an intermediate connecting plate and a bent plate. The down folding type runner removal device for the automated packaging system issimple and reliable in structure, can realize the packaging mode that a runner is on an upper die, and achieves runner removal technological processes of high-end package such as Quad Flat No-lead Package (QFN) and Ball Grid Array (BGA) of integrated circuits.

Description

technical field [0001] The invention belongs to the technical field of automatic packaging of semiconductor integrated circuits, and in particular relates to a fold-down flow channel removal device used in an automatic packaging system. Background technique [0002] With the development of my country's semiconductor integrated circuit packaging from low-end DIP, SOP, SOT and other packages to high-end LQFP, QFN, BGA and other packages, the mold structure design is also different from the traditional mold design. The most obvious feature is the mold runner design. On the upper mold and the parting surface of the product, the traditional punching type removal runner can no longer be used, and it is urgent to redesign the runner removal mechanism. Contents of the invention [0003] In view of the above-mentioned technical problems, the object of the present invention is to provide a fold-down runner removal device for an automatic packaging system with a simple structure and r...

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Problems solved by technology

[0002] With the development of my country's semiconductor integrated circuit packaging from low-end DIP, SOP, SOT and other packages to high-end LQFP, QFN, BGA and other packages, the mold structure design is also different from the traditional mold design. The most obvious feature is the mold runner design. On the upper mold and the parting surface of the product, the traditional punching type removal channel can no longer be used, and it is urgent to redesign the channel removal mechanism

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