Light guide with heat-resistant incident portion
A technology of incident part and light guide, applied in the field of light guide, can solve the problems of adverse effects of light distribution characteristics, reduction of light distribution efficiency of light guide 51, inability to cover light distribution angle θ, etc.
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Embodiment 1
[0032] Figure 1 ~ Figure 4 Example 1 of the present invention is shown. Such as figure 1 As shown, the light guide 11 of the first embodiment has the incident portion 13 and the protective portion 16 having the same diameter on the longitudinal axis or the optical axis A of the rod-shaped light guide 12 . Protector 16 is positioned at the base end of light guide 12, and one end face (end face 15 of light guide 12) of protector 16 is opposite to semiconductor light source 3, and the other end face 16a of protector 16 and one end face 13a of incident part 13 Close connection (refer to figure 2 ).
[0033] Such as figure 2 (a), (b), the incident part 13 is composed of the outgoing part 14 (refer to Figure 8 ) is molded from the same first transparent material, and the protective portion 16 is molded from a second transparent material with a softening point higher than that of the first transparent material. For example, if figure 2 As shown in (a), PMMA (acrylic resin...
Embodiment 2
[0037] Figure 5Example 2 of the present invention is shown. In this light guide 11 , the end surface of the incident portion 13 is equal to the end surface 15 of the light guide body 12 , and the peripheral surface of the incident portion 13 is partially or entirely covered by the heat dissipation cover 21 . Radiation cover 21 is the protective part of incident part 13, for example, as Figure 5 As shown in (a), a sheet-like or film-like member made of CNT is wound around the incident part 13, or as Figure 5 As shown in (b), a cylindrical member made of aluminum is inserted into the incident part 13, or a metal vapor-deposited film is coated on the peripheral surface of the incident part 13, etc., so that the incident part 13 is protected from the semiconductor light source (omitted). Shown) the heating effect. Therefore, the light guide 11 according to the second embodiment particularly has the advantage that the light guide body 12 can be inexpensively molded from a sin...
Embodiment 3
[0039] Figure 6 Example 3 of the present invention is shown. In this light guide 11 , an egg-shaped enlarged portion 23 is integrally formed at the proximal end of the light guide body 12 . The enlarged portion 23 is an incident portion through which light from the semiconductor light source 3 enters, and functions to increase the heat capacity of the incident portion. The end face (end face 15 of the light guide 12) of the enlarged part 23 is concavely provided with a curved surface 24 as a protective part, so that the transparent resin of the enlarged part 23 is separated from the semiconductor light source 3, and the enlarged part 23 is protected so that it is not protected from the semiconductor light source. 3. Fever effect. Therefore, according to the light guide 11 of the third embodiment, it is particularly advantageous that thermal damage to the incident portion can be easily suppressed only by changing the shape of the base end portion of the light guide body 12 ....
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