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SFP packaging electric interface module testing device

A technology of module testing and electrical port, which is applied in the direction of measuring devices, measuring electricity, and measuring electrical variables, etc., can solve the problems of large output of electrical port modules, slow test speed, and many uncertain factors in manual operation, so as to improve test efficiency and reliability effects

Active Publication Date: 2018-12-21
SHENZHEN HI OPTEL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This test method has the limitations of slow test speed and unable to send too many data packets, test results cannot be displayed intuitively, and can only be displayed by looking at the "Hyper Terminal" character, test results cannot be effectively saved, and employees are required to make special connections sex
[0003] In addition, the current production volume of electrical port modules is relatively large. Manual testing can only grab one electrical port module at a time, and then insert the electrical port module into the test circuit board and network crystal head, and select the test program to realize the test function. During the testing process of the electrical port module, the operator needs to wait for the test program to finish running to replace the electrical port module for plugging and testing, resulting in a lot of manual waste of time waiting for the test time
In the current testing process, there are many manual operation steps, and there are many uncertain factors in manual operation, which will easily lead to a large limit on the output per unit time, and the efficiency is not high

Method used

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  • SFP packaging electric interface module testing device
  • SFP packaging electric interface module testing device
  • SFP packaging electric interface module testing device

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Embodiment Construction

[0036] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0037] Considering that currently, when manually testing the electrical port module, only one electrical port module can be tested at a time. During the testing process, there are many manual operation steps, and there are many uncertain factors in manual operation, which will easily lead to a relatively large limit on the output per unit time. The efficiency is not high, therefore, the present invention proposes a testing device for an SFP package electrical port module.

[0038] Specifically, please refer to figure 1 as well as figure 2 , figure 1 It is a schematic diagram of the overall structure of a preferred embodiment of the SFP package electrical port module testing device of the present invention, figure 2 It is a schematic diagram of an exploded structure of a preferred embodiment of the SFP package ele...

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Abstract

The invention relates to an SFP packaging electric interface module testing device which comprises a base, a six-axis mechanical hand, a product carrier disc, product carrier disc placing frames, testing mechanisms, a first material feeding and discharging mechanism and a second material feeding and discharging mechanism. The two opposite ends of the base are provided with a first installation groove and a second installation groove correspondingly, the top of the first installation groove is provided with at least two product carrier disc placing frames, a to-be-tested material area is arranged between the two product carrier disc placing frames installed on the top of the first installation groove, at least two product carrier disc placing frames are installed on the top of the second installation groove, an accepted product placing area is arranged between the two product carrier disc placing frames installed on the top of the second installation groove, an installation base whereinthe six-axis mechanical hand and the multiple testing mechanisms is arranged between the first installation groove and the second installation groove, and an unaccepted product placing area is arranged on the installation base. Compared with the prior art, SFP packaging electric interface module testing efficiency and stability are improved.

Description

technical field [0001] The invention relates to the technical field of electrical port module testing, in particular to a testing device for an SFP packaged electrical port module. Background technique [0002] The SFP package electrical port module is widely used in the field of short-distance communication due to its good compatibility, low power consumption, reliability and stability. For manufacturers of mass-produced SFP-packaged electrical port modules, the solid-line LINK LENGTH test of the electrical port module is a necessary performance test method. Usually, the test terminal and the electrical port module are connected through a network cable of a certain electrical length, and then used such as " Tools such as "Hyper Terminal", send data packets through commands, and then observe the data flow status. This test method has the limitation that the test speed is slow and cannot send too many data packets, the test results cannot be displayed intuitively, and can on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B07C5/344B07C5/02B07C5/36G01R31/00
CPCG01R31/00B07C5/02B07C5/344B07C5/361B07C5/362
Inventor 张华林艺超李慧琳刘杰
Owner SHENZHEN HI OPTEL TECH