Optical IC chip sampling machine with laser cutting function

Abstract

Provided in the invention is an optical IC chip sampling machine with the laser cutting function. The optical IC chip sampling machine comprises a rack body, a material box mechanism, a pushing mechanism, a reclaiming mechanism, a transport mechanism, a microscope mechanism, and a laser cutting mechanism. The location of the material box mechanism can be adjusted up and down or in an X direction or a Y direction. The pushing mechanism is able to push a chip stripe in the material box mechanism out of the material box mechanism. The reclaiming mechanism is able to clamping the chip stripe pushed out by the pushing mechanism on the transport mechanism. The transport mechanism transports the chip stripe to be under the microscope mechanism or transports the chip stripe to be under the laser cutting mechanism for cutting or marking. According to the invention, the whole chip stripe checking process including chip stripe selection, transport, observation, and processing is implemented without hand contact with the chip stripe, so that the manual secondary damage of the chip is avoided.

Description

technical field [0001] The invention relates to a chip sampling inspection machine, in particular to an IC chip optical sampling inspection machine with laser cutting function. Background technique [0002] Before packaging electronic chips, wire arcs and solder balls need to be inspected to avoid the impact of wire arcs and solder ball defects on chip performance and yield. Chip strips cannot be touched by hand before packaging, otherwise it is easy to cause artificial secondary damage to the chip. In the traditional inspection of chip strips, the inspectors pull the chip strips by hand to observe under the microscope. For chip components with quality defects, it is necessary to manually hook the arcs, which causes the hands to touch the chip strips and damage the chips. Secondary damage to the strips; in addition, the human eye is prone to fatigue and damages the eyes after observing under the microscope for a long time. Contents of the invention [0003] In view of th...

AI Technical Summary

Problems solved by technology

Chip strips cannot be touched by hand before packaging, otherwise it is easy to cause artificial secondary damage to the chip

In the traditional inspection of chip strips, the inspectors pull the chip strips by hand to observe under the microscope. For chip components with quality defects, it is necessary to manually hook the arcs, which causes the hands to touch the chip strips and damage the chips. Secondary damage to the strips; in addition, the human eye is prone to fatigue and damages the eyes when observing under a microscope for a long time

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