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Packaging device and a tensioning and adjusting device of a wafer blue film thereof

A technology for adjusting devices and packaging equipment, which is applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., and can solve problems such as affecting product production quality.

Active Publication Date: 2018-12-21
广东阿达智能装备有限公司
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] Since the wafer blue film has a position deviation when it is placed on the support device, and at the same time, there is a corresponding position deviation when the wafer is placed on the wafer blue film, which leads to a corresponding position deviation in the subsequent process. Affect the production quality of the product

Method used

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  • Packaging device and a tensioning and adjusting device of a wafer blue film thereof
  • Packaging device and a tensioning and adjusting device of a wafer blue film thereof
  • Packaging device and a tensioning and adjusting device of a wafer blue film thereof

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Embodiment Construction

[0026] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present invention, and do not limit the protection scope of the present invention.

[0027] It should be noted that when an element is referred to as being “disposed on” or “fixed on” another element, it may be directly on another element or there may be an intervening element. When an element is referred to as being "fixed on" another element, or "fixedly connected" to another element, it may be detachably fixed or non-detachably fixed therebetween. When an element is referred to as being "connected" or "sealed to" another element, it can be directly connected to the other element or intervening elements may also be present. As used...

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Abstract

The invention discloses a packaging device and a tensioning and adjusting device of a wafer blue film thereof. The base is provided with an abutting member and a guide member. At least two guide members surround and form a guide region and cooperate to form a first guide portion, and the abutting member is arranged in the guide region. The rotating body is sleeved on the abutment member and is guided and cooperated with the first guide part; The drive mechanism is used for enabling the rotating body to rotate about the axis of the abutment member; The discharge platform can rotate relative tothe abutment about the axis of the abutment, and the discharge platform can reciprocate relative to the abutment along the length of the abutment. The tensioning and adjusting device of the wafer bluefilm can adjust and eliminate the position deviation of the wafer blue film and the wafer placed on the tensioning and adjusting device, thereby ensuring that the subsequent production process can becarried out accurately; Thus, the packaging device using the tensioning and adjusting device can adjust and eliminate the position deviation of the wafer blue film and the wafer, and each productionprocess can be carried out accurately, so as to ensure the production quality of the product.

Description

technical field [0001] The invention relates to the technical field of packaging and setting, in particular to a packaging device and a tensioning and adjusting device for a blue film of a wafer. Background technique [0002] With the development of science and technology, the semiconductor industry has become one of the important cornerstones supporting social development. In semiconductor back-end packaging equipment, such as die-bonding machines and flip-chip machines, the blue film of the wafer needs to be placed on the supporting device after it is taken out of the material box. Fixed on the top, so as to carry out the subsequent process. [0003] Since the wafer blue film has a position deviation when it is placed on the support device, and at the same time, there is a corresponding position deviation when the wafer is placed on the wafer blue film, which leads to a corresponding position deviation in the subsequent process. Affected the production quality of the prod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/67011H01L21/6835H01L2221/68309
Inventor 贺云波刘青山王波刘凤玲陈桪
Owner 广东阿达智能装备有限公司
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