A Method to Guarantee Port Standing Wave Performance

Abstract

The invention belongs to the field of microwave technology, and in particular relates to a method for ensuring the standing wave performance of a port. The method comprises the following steps: step 1, expanding the diameter of the non-positioning section, and ensuring that the diameter of the non-positioning section is smaller than the diameter of the tin storage section; step 2, setting a solder sheet between the substrate and the structural member, and opening a solder hole on the solder sheet, To expose the air section; Step 3, heat to melt the solder sheet, and realize the welding of the substrate and the structural part; Step 4, coat the solder layer on the positioning section of the structural part and the inner surface of the tin storage section; Step 5, connect the coaxial The connector is placed in the structural part, and the solder layer is melted by heating to realize the welding of the coaxial connector and the structural part. This method effectively guarantees the realization of the port standing wave performance by optimizing the design of the structural parts and optimizing the welding process.

Description

technical field [0001] The invention belongs to the field of microwave technology, and in particular relates to a method for ensuring the standing wave performance of a port. Background technique [0002] Most of the external microwave signal input and output ports of the microwave module are coaxial connectors, while the internal microwave signal input and output ports of the microwave module are mostly microstrip line structures set on the substrate, and the metal probes of the coaxial connector are transitionally connected to the microstrip line When , there is a certain discontinuity, which will affect the port standing wave. In order to eliminate the influence of the discontinuity of the transition connection on the standing wave of the port, the impedance matching design of the port is required. One of the commonly used methods for impedance matching design is to design air sections of different lengths and diameters on the structural parts according to the signals of ...

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Problems solved by technology

[0003] like figure 1 As shown, in order to ensure the reliable fixing of the structural component 2, the coaxial connector 3 and the substrate 1, ensure the ground continuity between the substrate 1 and the structural component 2, and realize the airtight packaging of the microwave module, solder paste is usually used for the The structural part 2 is welded with the substrate 1 and the coaxial connector, but in this process, on the one hand, due to the solder paste coating amount and coating on the welding surface between the substrate 1 and the structural part 2 and the coaxial connector 3 and the structural part 2 It is difficult to accurately control the coating area and coating uniformity, which leads to the fact that the solder paste is often squeezed into the air section A from the connection between the substrate 1 and the structural part 2 or the non-positioning section B in the extrusion state; on the other hand, in high temperature soldering During the process, the solder paste between the substrate 1 and the structural part 2 and the coaxial connector 3 and the structural part 2 is in a molten state, and its flow direction is difficult to control, resulting in the melted solder paste often flowing along the surface of the solder layer to the air section A

When solder paste enters the air section A, it will affect the shape of the impedance matching structure, making the standing wave performance of the port decrease, making it difficult to achieve the design performance

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