Manufacturing method of single-input and double-outlet sound hole microphone substrate

Abstract

The invention discloses a manufacturing method of single-inlet double-outlet sound hole microphone substrate. The manufacturing method of single-inlet double-outlet sound hole microphone substrate ischaracterized in that through two asymmetric thick-copper core boards and a laser prepreg, square-shaped copper rings are formed, and the square-shaped copper rings on the core boards can achieve theeffect of isolating the prepreg resin, so as to prevent the resin flowing into a sound hole channel; and an inlet and outlets for the sound hole are formed through laser processing, when the laser isirradiated, the bottom of the hole is blocked by copper sheets, thus avoiding the laser irradiating to the other core board to destroy the sound hole channel. The sound hole manufactured by the manufacturing method of a single-inlet double-outlet sound hole microphone substrate is single-inlet double-outlet structure, thus guaranteeing consistency of signals received by two acoustoelectric sensors. Two acoustoelectric sensors are packaged in one MEMS microphone, thus improving the pickup accuracy, and reducing the product cost when compared with a traditional product which uses two microphones.

Description

technical field [0001] The invention relates to a manufacturing method of a single-inlet and double-outlet sound hole microphone substrate. Background technique [0002] With the development of the smart device industry, more and more electronic devices have added voice control functions, and the requirements for the accuracy of sound pickup by MEMS microphones are gradually increasing. At present, the structures of MEMS microphones on the market mainly include: 1) a package substrate with a sound hole; 2) an acoustic-electric sensor that can convert sound wave vibration into an electrical signal; 3) a dedicated integrated chip with an analog-to-electrical conversion function; 4) Aluminum shell that can be directly SMD welded. The acoustic-electric sensor is mounted on the sound inlet of the packaging substrate through silica gel. The current MEMS microphone design is mainly a sound inlet and an acoustic-electric sensor. If you want to improve the sound pickup accuracy, yo...

AI Technical Summary

Problems solved by technology

The current MEMS microphone design is mainly a sound inlet and an acoustic-electric sensor. If you want to improve the sound pickup accuracy, you can only increase the number of microphones. resulting in differences in the collected sound signals

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