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Photosensitive film laminate and cured product of same

A photosensitive film and laminate technology, applied in the direction of photosensitive materials used in optomechanical equipment, etc., can solve problems such as poor appearance and reduced concealment of solder mask layers

Pending Publication Date: 2019-01-04
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Along with this, the following problems arise: the concealment of the solder resist layer is reduced, and the discoloration of the underlying circuit is seen through the solder resist layer, resulting in poor appearance.

Method used

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  • Photosensitive film laminate and cured product of same
  • Photosensitive film laminate and cured product of same
  • Photosensitive film laminate and cured product of same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0147]

[0148] To the photosensitive resin composition 1 obtained as described above, 300 g of methyl ethyl ketone was added, diluted, and stirred with a mixer for 15 minutes to obtain a coating liquid. The coating liquid was applied to a 25 μm thick polyethylene terephthalate film (Lumiror T60 manufactured by Toray Co., Ltd., Ra=0.03 μm) as a support film, and dried at a temperature of 80°C for 15 minutes. A photosensitive film with a thickness of 20 μm is formed. Next, a 15 μm-thick polypropylene film (ALPHAN MA-411 manufactured by Oji Aifute Co., Ltd., Ra=0.4 μm) was pasted on the photosensitive film as a protective film to produce a photosensitive film laminate.

Embodiment 2

[0150] In Example 1, the photosensitive resin composition 2 was used instead of the photosensitive resin composition 1, and it carried out similarly to Example 1, and obtained the photosensitive film laminated body 2 except otherwise.

Embodiment 3

[0152] In Example 1, except for using the photosensitive resin composition 3 instead of the photosensitive resin composition 1, it carried out similarly to Example 1, and obtained the photosensitive film laminated body 3.

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Abstract

Provided is a photosensitive film laminate which does not deteriorate the working environment even if carbon black is contained in the photosensitive resin composition forming the photosensitive film.The photosensitive film laminate which is a photosensitive film laminate obtained by laminating a support film and a photosensitive film composed of a photosensitive resin composition, wherein the photosensitive resin composition contains at least the carbon black and the filler having charges opposite to the charges of the carbon black.

Description

Technical field [0001] The present invention relates to a photosensitive film laminate and a cured product thereof. Background technique [0002] Generally, in a printed circuit board used in electronic equipment, etc., when mounting electronic components on the printed circuit board, in order to prevent solder from adhering to unnecessary parts, place the circuit pattern in the area other than the connection hole on the substrate A solder resist layer is formed. [0003] In recent years, with the high precision and high density of printed circuit boards brought about by the lighter, thinner, shorter and smaller electronic devices, at present, the use of the following so-called photosensitive solder resist to form a solder resist is becoming the mainstream, that is, coating on the substrate The photosensitive resin composition is dried, and after forming a pattern by exposure and development, the resin after the pattern formation is cured by heating or light irradiation. [0004] I...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004
CPCG03F7/004
Inventor 岛宫真梨子舟越千弘加藤文崇高桥元范佐藤和也荒井康昭伊藤信人
Owner TAIYO HLDG CO LTD