Unlock instant, AI-driven research and patent intelligence for your innovation.

Wafer Bonder

A bonding machine and wafer technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems such as bubbles are easy to remain, bubbles cannot escape in time, and product yield drops, so as to achieve quick response and reduce Bubbles and cavities, controlled rapid effects

Active Publication Date: 2021-04-09
淮安西德工业设计有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, during the bonding process of the two wafers, the upper wafer is fully combined with the lower wafer through gravity, and the air bubbles located between the wafers cannot escape in time during this process. Air bubbles tend to remain between two wafers, resulting in a decrease in product yield

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer Bonder
  • Wafer Bonder
  • Wafer Bonder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0043] The first embodiment of the present invention provides a wafer bonding machine, see figure 1 with Figure 5 As shown, it includes a controller 11 and a machine platform 12. Two chucks 13 for bonding two wafers 10 are arranged on the machine platform 12, and the two chucks 13 are arranged up and down opposite to each other. The machine table 12 is also provided with a positioning frame 14 for supporting the lower chuck 13 , a manipulator 15 for transferring the position of the wafer 10 , and a driving member 16 for driving the upper chuck 13 to move up and down. In this embodiment, the driving member 16 is a screw assembly, and the screw of the screw assembly is fixedly connected to the upper chuck 13 . In other embodiments, the driving member 16 can also be other driving structures.

[0044] When the wafer bonding machine is working, the manipulator 15 moves the two wafers 10 between the upper and lower chucks 13 respectively, and the lower surface of the upper wafer ...

Embodiment approach 2

[0070] The second embodiment of the present invention provides a wafer bonding machine. The second embodiment is a further improvement on the first embodiment. Parts not specifically described include symbols and text descriptions, which are the same as the first embodiment. , which will not be repeated here.

[0071] The main improvement of the second embodiment over the first embodiment is that in the second embodiment of the present invention, the combination Image 6 As shown, in order to prevent the vacuum tube 8 from being blocked or damaged, the vacuum tube 8 cannot vacuum the vacuum shell 7, a plurality of vacuum tubes 8 are arranged in each independent bonding area 2, and multiple vacuum tubes 8 in each bonding area 2 The vacuum tubes 8 are connected through the air passage 9, and a plurality of vacuum tubes 8 are evenly distributed around the center of the vacuum shell 7. At this time, multiple vacuum tubes 8 jointly extract the air in the vacuum shell 7 , which can...

Embodiment approach 3

[0075] The third embodiment of the present invention provides a wafer bonding machine. The third embodiment is a further improvement on the first or second embodiment. Or the second embodiment is the same, and will not be repeated here.

[0076] The main improvement of the third embodiment compared with the first or second embodiment is that, in the third embodiment of the present invention, the combination Figure 7 As shown, preferably, there is at least one bonding point in each independent bonding area 2, and there are multiple bonding points in some of the bonding areas and they are evenly distributed. Because when there are multiple bonding points in the bonding area 2, the overall bonding point quantity of the chuck 13 increases, the bonding point density in a single bonding area increases, and the bonding accuracy of the wafer bonding machine is high, which can be more efficient. Precise and effective driving and control of the bonding of the two wafers 10 reduces bub...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of semiconductor processing equipment, and discloses a wafer bonding machine which can bond in sequence and reduce the generation of air bubbles. The wafer bonding machine includes two chucks, each chuck includes a support and a bonding area arranged on the support, at least one chuck has multiple bonding areas, and multiple bonding areas located on the same chuck The zones are independently arranged, and each independent bonding zone has a bonding point for abutting with the wafer. The wafer bonding machine also includes a bonding mechanism for controlling the bonding sequence of the bonding points. The present invention utilizes the bonding mechanism to adjust the bonding sequence of the bonding points, so that the two wafers are bonded in an orderly manner. During the orderly bonding of the wafers, the air gradually moves and runs out along the bonding direction, reducing the bubbles and voids generated between the two wafers and improving the product yield.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing equipment, in particular to a wafer bonding machine capable of sequentially bonding and reducing bubble generation. Background technique [0002] Wafer bonding refers to the direct bonding of two homogeneous or heterogeneous semiconductor materials with clean surfaces and atomic level flatness after surface cleaning and activation treatment under certain conditions. All in one technology. Wafer bonding technology is widely used in packaging, MEMS, 3D interconnection, LED manufacturing, special substrate manufacturing and other fields, and has increasingly become an indispensable R&D and production tool in the semiconductor and MEMS fields. Two flat substrates are bonded face to face, and certain external conditions such as pressure, temperature, and voltage are applied, and the interface between the original two substrates will generate atomic or intermolecular bonding forces, su...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67011
Inventor 刘博佳王海宽吴龙江林宗贤
Owner 淮安西德工业设计有限公司