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Optical chip module and manufacturing method thereof

A technology of optical chips and modules, which is applied in radiation control devices, semiconductor/solid-state device manufacturing, televisions, etc. It can solve the problems of filling the adhesive layer affecting the optical effect, etc., and achieve the effect of stabilizing the adhesive layer and ensuring optical performance

Pending Publication Date: 2019-01-11
KUNSHAN Q TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, the purpose of the embodiments of the present invention is to provide an optical chip module and a manufacturing method thereof, so as to improve the problems that the filling glue layer will affect the optical effect in the existing optical chip packaging process.

Method used

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  • Optical chip module and manufacturing method thereof
  • Optical chip module and manufacturing method thereof
  • Optical chip module and manufacturing method thereof

Examples

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no. 1 example

[0037] see figure 2 , the present embodiment provides an optical chip module 20 to solve the problem that the filling glue layer 234 will affect the optical effect in the existing packaging process of the optical chip 210 .

[0038] In the optical chip module 20 provided in this embodiment, when bonding the optical chip 210 and the optical filter 270 with glue, the glue is fixed by setting the fixing layer 233 to prevent the glue from flowing into the photosensitive area 2111 of the optical chip 210 . The air chamber 250 can be formed between the photosensitive area 2111 of the optical chip 210 and the optical filter 270 to ensure the optical performance of the optical chip 210 .

[0039]The optical chip module 20 provided in this embodiment includes a filter 270 , a fixing layer 233 , an adhesive layer 234 and an optical chip 210 . The adhesive layer 234 is used to connect the optical filter 270 and the optical chip 210, and the fixed layer 233 is arranged on the optical fi...

no. 2 example

[0052] The embodiment of the present invention provides a manufacturing method of the optical chip module 20, and the method provided in the embodiment of the present invention is used to manufacture the optical chip module 20 provided in the first embodiment.

[0053] The manufacturing method of the optical chip module 20 is used to connect the optical filter 270 and the optical chip 210, the optical chip 210 includes a first surface 211, the first surface 211 includes a photosensitive area 2111 and a non-photosensitive area 2112, the The filter 270 includes a first plane 271 opposite to the first surface 211 .

[0054] see Figure 7 , the manufacturing method of the optical chip module 20 provided by the present invention comprises:

[0055] Step S10 : the first surface 211 the non-photosensitive area 2112 the first plane 271 the photosensitive area 2111 the filter 270 and set the fixed layer 233 within the preset range of the first plane 271 .

[0056] The optical chip 21...

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Abstract

The invention provides an optical chip module and a manufacturing method thereof, The optical chip module includes a filter, optical chip, adhesive layer and fixing layer. The optical chip includes afirst surface, a first surface includes a photosensitive region and a non-photosensitive region, the filter includes a first plane opposite the first surface, the first plane is bonded to the non-photosensitive region of the first surface by an adhesive layer, the fixing layer is arranged in a preset area range of the first plane. The position of the adhesive layer corresponds to the fixing layer,and the fixing layer and the adhesive layer are adhered to prevent the adhesive layer from flowing, so that the adhesive layer and the fixing layer support and connect the optical filter, so that theadhesive layer is stable, thereby avoiding the optical filter and the photosensitive area of the optical chip from being filled with glue, and ensuring the optical performance of the optical chip.

Description

technical field [0001] The invention relates to the technical field of optical chip modules, in particular, to an optical chip module and a manufacturing method thereof. Background technique [0002] In the optical chip packaging process for cameras or optical fingerprints, sometimes it is necessary to directly bond the optical filter and the chip together to meet the structural or functional requirements of the product. The existing process is to directly use high-transmittance optical Glue is used for bonding, that is, the glue is dotted on the surface of the chip first, and then the filter is bonded to the surface of the chip. The problem with this process and structure is that the chip and the filter are directly bonded with glue, causing the chip and the filter to be glued together. There is an insulating layer of glue between the light sheets. [0003] For a photosensitive chip with a microlens, if there is an optical glue layer filled between the filter and the photo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L27/146H01L21/56H04N5/225
CPCH01L27/146H01L21/56H01L23/3114H04N23/55H01L2224/16225
Inventor 田家俊
Owner KUNSHAN Q TECH CO LTD