Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A positioning carrier for stereoscopic electronic component

A technology for electronic components and positioning carriers, applied in the direction of electrical components, electrical components, etc., can solve problems such as improper operation techniques, low installation efficiency of electronic components, and reduced work efficiency

Pending Publication Date: 2019-01-11
KUNSHAN DONGYE ELECTRONICS
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. Positioning refers to ring-shaped electronic components through a jig. The jig is usually punched on a metal plate to form a positioning hole, and then the electronic component is directly positioned in the positioning hole. The existing problem is that the installation efficiency of the electronic component is low
Using this method, due to factors such as improper operation techniques, it is easy to cause damage to electronic components, waste time and manpower, and reduce work efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A positioning carrier for stereoscopic electronic component
  • A positioning carrier for stereoscopic electronic component
  • A positioning carrier for stereoscopic electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The present invention will be more fully understood from the following detailed description, which should be read in conjunction with the accompanying drawings. Detailed embodiments of the present invention are disclosed herein; however, it is to be understood that the disclosed embodiments are merely exemplary of the invention, which may be embodied in various forms. Therefore, specific functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a teaching to one skilled in the art that, in fact, any suitably detailed embodiment may differ in any suitably detailed embodiment. The manner employs the representative basis of the present invention.

[0030] combine Figure 3-6 As shown, an embodiment of the present application provides a positioning carrier for three-dimensional electronic components, including a substrate 21 , a positioning block 22 and a retaining bar 23 .

[0031] The surface of the substrate ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a positioning carrier of a stereoscopic electronic component, which comprises a substrate with a card slot arranged in a surface thereof; a positioning block fitting the card slot and provided with at least one position slot for positioning that electronic component, and the top end of each position slot being respectively provided with an SMT window, and the SMT window iscommunicated with the positioning slot; a stopper strip formed on one side of the positioning block and surrounding the positioning block to form the positioning groove. A surface of each substrate ofthat invention can be arrayed with a plurality of strip-like card slot, and the positioning of the electronic components can be realized through a positioning block and a stopper beforehand when assemble, and after the electronic components are loaded, each positioning block and the stopper can form an integral body, so that the electronic components can be assembled with the substrate more efficiently.

Description

technical field [0001] The present application relates to the field of semiconductor technology, in particular to a positioning carrier for three-dimensional electronic components. Background technique [0002] combine figure 1 with 2 As shown, it refers to a ring-shaped electronic component 10 , the circuit board of which is in the shape of a ring as a whole, and has at least one SMT area 101 on its surface. [0003] Surface mount technology (SurfaceMountTechnology, SMT), which is a non-lead or short-lead surface mount components mounted on the surface of the area 101 to be SMT, by reflow soldering or dip soldering and other methods to solder and assemble the circuit assembly technology. The premise of the implementation of circuit assembly and connection technology is: securely position the electronic components, otherwise it is very easy to cause damage to the electronic components, and the current common SMT installation methods are: [0004] 1. Positioning refers to ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K13/04
CPCH05K13/046
Inventor 王海浪
Owner KUNSHAN DONGYE ELECTRONICS
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com