Liquid crystal display panel, display device and manufacturing method of liquid crystal display panel

A liquid crystal display panel and substrate technology, which is applied in nonlinear optics, instruments, optics, etc., can solve the problems that LCD display panels cannot be applied, is not conducive to reducing the border of LCD display panels, etc., and achieves improved user experience and a more technological sense. , the effect of high yield

Inactive Publication Date: 2019-01-15
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, the inventors of the present application have found that the current COP process can only be applied to

Method used

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  • Liquid crystal display panel, display device and manufacturing method of liquid crystal display panel
  • Liquid crystal display panel, display device and manufacturing method of liquid crystal display panel
  • Liquid crystal display panel, display device and manufacturing method of liquid crystal display panel

Examples

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Example Embodiment

[0035] The present application will be described in detail below. Examples of embodiments of the present application are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar components or components with the same or similar functions. In addition, if a detailed description of the known technology is unnecessary for the illustrated features of the present application, it will be omitted. The embodiments described below with reference to the accompanying drawings are exemplary, and are only used to explain the present application, and cannot be construed as a limitation to the present application.

[0036] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as those commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms such as those d...

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Abstract

The embodiment of the invention provides a liquid crystal display panel, a display device and a manufacturing method of the liquid crystal display panel. The liquid crystal display panel comprises a first substrate and a second substrate arranged oppositely, and a liquid crystal layer located between the first substrate and the second substrate. The second substrate is a flexible substrate, including a parallel part and a bending part; the parallel part is located at the display region of the liquid crystal display panel and is parallel with the first substrate; the bending part is located atthe peripheral region of the liquid crystal display panel; the bending part is arranged far away from the first substrate and the regular projection region of the bending part at the parallel part ispartially overlapped with the parallel part; and the bending part is provided with a plurality of chips and a plurality of flat cables. In the embodiment of the invention, the frame dimension of the display panel is greatly reduced, application of a COP technology to the liquid crystal display panel is realized and a full-screen design almost without frame of the liquid crystal display panel can be realized.

Description

technical field [0001] The present application relates to the field of display technology, and in particular, the present application relates to a liquid crystal display panel, a display device, and a method for manufacturing a liquid crystal display panel. Background technique [0002] With the continuous popularization of portable smart terminal devices, the frame of the display panel of the smart terminal device is getting narrower and narrower, and even a full screen with almost no frame can be achieved. [0003] The current display panel generally adopts two types of OLED (Organic Light-Emitting Diode, organic light-emitting diode) display panel and LCD (Liquid Crystal Display, liquid crystal display) display panel. [0004] The current chip packaging mainly adopts three technologies of COG (Chip On Glass), COF (Chip On Flex, or, Chip On Film) and COP (Chip On Pi) for chip packaging, and the use of COP technology can be compared with COG and COF technology. Significant...

Claims

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Application Information

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IPC IPC(8): G02F1/1333G02F1/1345
CPCG02F1/133305G02F1/13452G02F1/13456
Inventor 王凯旋梁栋李姣彭晓青
Owner BOE TECH GRP CO LTD
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