A computer notebook modular skeleton mechanism and cushioning method
A buffering method and notebook technology, applied in computing, instrumentation, electrical digital data processing, etc., can solve the problem of processor, memory stick wireless module and hard disk displacement, processor, memory stick wireless module and hard disk damage, notebook computer economy Loss and other issues, to avoid economic losses, light weight, light overall weight
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Embodiment 1
[0023] The present invention provides such Figure 1-4 A computer notebook modular skeleton mechanism shown includes a skeleton body 1, a CUP installation groove 2 is arranged on the skeleton body 1, and a memory placement groove 3 is arranged on one side of the CPU installation groove 2, and a memory placement groove 3 is arranged on the side of the memory placement groove. 3. The top is provided with a wireless module placement slot 4. One side of the wireless module placement slot 4 is provided with a hard disk placement slot 5. The tops of the CPU installation slot 2, memory placement slot 3, wireless module placement slot 4 and hard disk placement slot 5 are A mounting assembly 6 is provided, and the mounting assembly 6 includes a first U-shaped plate 7 and a second U-shaped plate 8, the second U-shaped plate 8 is arranged on one side of the first U-shaped plate 7, and the first U-shaped plate 8 Elastic heat conduction pads 9 are provided inside the shaped plate 7 and the...
Embodiment 2
[0034] A kind of buffering method of computer notebook, comprises described computer notebook modular skeleton mechanism, also comprises following method:
[0035] When the computer installed with the present invention falls, the vibration generated by the drop is transmitted from the notebook computer shell to the frame body 1, and then from the frame body 1 to the CUP installation slot 2, the memory placement slot 3, and the wireless module placement slot 4 and the hard disk slot 5 are installed on the top of the component 6. The processor, memory stick, wireless module and hard disk inside, in this process, the force generated by the vibration is first buffered by the spring 11, and then the buffered force is transmitted by the spring 11 On the first U-shaped plate 7 and the second U-shaped plate 8, the elastic heat conduction pad 9 inside the first U-shaped plate 7 and the second U-shaped plate 8 absorbs the buffered force again, thereby reducing the vibration to the instal...
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