A mechanical analysis method of mems double-end fixed beam structure based on the bending condition of flexible substrate
A flexible substrate, structural mechanics technology, applied in the field of mechanical analysis, can solve problems such as blank
Active Publication Date: 2020-11-06
SOUTHEAST UNIV
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Problems solved by technology
At present, whether it is based on silicon-based or various types of flexible substrates, the main research content and purpose of RF MEMS flexible devices are still in the stage of device design, preparation and performance testing under non-bending conditions. The bending characteristics of RFMEMS flexible devices The research on modeling and experimental characterization verification is still blank
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[0049] The present invention will be further explained below in conjunction with the accompanying drawings.
[0050] Such as figure 1 As shown, the present invention takes the RF MEMS double-end fixed beam as an example. In this embodiment, the value of each parameter is taken. The material of the RFMEMS double-end fixed beam electrostatically driven switch beam is gold, and the flexible substrate material is liquid crystal polymer. (LCP), beam length L=600 μm, beam width w=100 μm, beam thickness t=2 μm, initial distance between upper and lower plates g=2 μm, beam Young’s modulus E=78Gpa, Poisson’s ratio n=0.42 . Assuming that the above-mentioned RF MEMS double-terminal fixed beam electrostatic drive switch initially has biaxial residual compressive stress, the beam buckles upward, and the maximum buckling distance h=0.5μm, as the flexible substrate gradually bends, the curvature of the substrate gradually increases from 0 to 33.3m -1 .
[0051] The specific steps are as fo...
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Provided is a mechanical analysis method of an MEMS double-end fixed beam structure under bending condition of a flexible substrate. The invention aims to provide an estimation method for a change rule of mechanical property parameters of the MEMS double-end fixed beam structure under the bending condition of the flexible substrate. Two steps are mainly adopted to model the bending characteristics of the MEMS double-end fixed beam structure under the bending condition of the flexible substrate, to obtain an analysis model of the influence of the deformation of the MEMS double-end fixed beam structure on the mechanical property of a device. Firstly, establishing a deformation coupling model on the basis of double deformation of the MEMS double-end fixed beam structure and the flexible substrate, and extracting key structural parameter change amounts between the MEMS double-end fixed beam structure and the flexible substrate. Secondly, on the basis of the bending characteristic model of the MEMS double-end fixed beam structure, obtaining the deformation amounts of the double deformation of the MEMS double-end fixed beam structure and the flexible substrate and the stress introduction amounts in the MEMS double-end fixed beam structure. On the basis of said parameters, the mechanical model of the MEMS double-end fixed beam structure is reconstructed, and the influence of bending deformation on the mechanical property of the MEMS double-end fixed beam structure is analyzed. In order to fill the domestic and foreign research blank of the flexible device model of the MEMS double-end fixed beam structure, the mechanical analysis method of the MEMS double-end fixed beam structure taking the influence of the biaxial residual stress of the MEMS double-end fixed beam structure into account in a complex environment space containing the double deformation model of the the MEMS double-end fixed beam structure and the flexible substrate is provided.
Description
technical field [0001] The invention relates to a mechanical analysis method, in particular to a structural mechanical analysis method of a MEMS double-end fixed beam under the bending condition of a flexible substrate. Background technique [0002] In today's wave of information development, flexible electronic devices have very broad application prospects in the fields of national defense, information, medical treatment, and energy due to their unique bendability and high-efficiency and low-cost manufacturing processes. As a popular development direction of the new generation of semiconductor devices, flexible electronic devices are emerging electronic technologies based on bendable / extensible substrates, which fabricate active / passive organic / inorganic electronic devices on flexible substrates, which have the advantages of traditional rigid electronic systems. It also has the unique characteristics of stretching, twisting, and folding, so it has incomparable importance an...
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IPC IPC(8): G06F30/13G06F30/20G06F119/14
CPCG06F30/20G06F2119/06
Inventor 韩磊于洋吴虹剑田蕾吝晓楠刘星
Owner SOUTHEAST UNIV