Ribbon trimming and forming method of semiconductor device and semiconductor device processing equipment

Abstract

The invention discloses a rib-cutting molding method for semiconductor devices. The multiple semiconductor devices are arranged on a matrix frame in an array manner, the semiconductor devices in adjacent rows are connected through connection ribs, and the matrix frame comprises an edge frame, a plurality of lead feet connecting the edge frame and the semiconductor devices and reinforcing ribs connecting all the lead feet. The rib-cutting molding method comprises the following steps of a burr cutting step, a reinforcing rib cutting step, an edge frame cutting step and a separating step. By means of the rib-cutting molding method for the semiconductor devices, breaking and everywhere-splashing of chippings generated in the rib-cutting process can be avoided, operators do not need to pause amachine to clear the large amount of chippings inside, the production efficiency is improved, meanwhile, pollution and damage of burr on machine precision components are avoided, the problem of pollution on products by the burr is completely eradicated, and the degraded product rate is decreased. The invention further discloses semiconductor device machining equipment applying the above method.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a method for trimming and forming semiconductor devices and semiconductor device processing equipment. Background technique [0002] At present, the integrated circuit matrix lead frame (that is, the matrix frame) is generally designed with a width within 10mm to 30mm, in a double row or single row design, each with 10 to 20 units, and the semiconductors in the same column pass through the two sides. The pins are respectively connected to the frame frames on both sides, and the semiconductors in the same line are connected through connecting ribs. This frame adopts a traditional plastic sealing mold. [0003] However, due to the special design of the TO252 matrix frame, burrs will inevitably remain on the connecting ribs after the lead frame is cut. The traditional TO252 rib cutting process does not have a special deburring step. Therefore, the excess burrs will ...

AI Technical Summary

Problems solved by technology

[0012] In order to overcome the deficiencies in the prior art, one of the purposes of the present invention is to provide a method for trimming and forming of semiconductor devices, which can avoid fragments from breaking and splashing around in the process of trimming, and does not require the operator to suspend the machine to perform a large amount of internal inspection. Clean up the debris to improve production efficiency. At the same time, it avoids the pollution and damage of burrs to the precision parts of the machine, and eliminates the problem of products being polluted by burrs, reducing the rate of defective products.

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