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Cooling device

A heat sink and heat dissipation fin group technology, which is applied in the direction of electric solid-state devices, semiconductor devices, lighting and heating equipment, etc., can solve the problem of many heat sink assembly steps, and achieve the effect of simplifying heat sink assembly

Pending Publication Date: 2019-02-19
SHENZHEN FLUENCE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The application provides a radiator to solve the problem of many radiator assembly steps in the prior art

Method used

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Embodiment Construction

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only some structures related to the present application are shown in the drawings but not all structures. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0019] The terms "first" and "second" in this application are only used for descriptive purposes, and should not be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. thu...

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Abstract

The invention provides a cooling device which comprises a cooling fin group, a lamp box and two enclosed shells. The lamp box is of a box-shaped structure, first through holes are formed in the side surfaces of the lamp box, second through holes are formed in the top surface of the lamp box, third through holes corresponding to the second through holes are formed in the bottom surface of the lampbox, each enclosed shell comprises a mounting plate, an enclosed plate and an inserting plate, the enclosed plates are arranged around the outer side edges of the mounting plates and extend to the cooling fin group, two enclosed plates of the enclosed shells are abutted to form containing space with two end openings, the cooling fin group is assembled in the containing space and extends from one end opening to contact with a heat source, the lamp box covers the other end opening, the inserting plates are connected with the enclosed plates and extend to the cooling fin group to penetrates the first through hole to be inserted into the lamp box, and screws can sequentially penetrate the second through holes, the inserting plates and the third through holes and are connected with the coolingfin group, so that the cooling fin group, the lamp box and the enclosed shells are integrally connected. The cooling device is convenient to assemble.

Description

technical field [0001] The present application relates to the technical field of radiators, in particular to a radiator. Background technique [0002] At present, heat sinks are often used in the heat dissipation of computer hosts, such as heat sinks for CPUs and graphics cards. In order to cater to more consumers, other non-heat dissipation functions are often added to the heat sink, for example, adding a light emitting function to the heat sink, but this will inevitably make the assembly of the heat sink more complicated. Contents of the invention [0003] The present application provides a radiator to solve the problem of many radiator assembly steps in the prior art. [0004] In order to solve the above technical problems, a technical solution adopted by this application is to provide a heat sink, which includes a heat dissipation fin group, a light box and an enclosure; the light box is a box-shaped structure, and the side of the light box A first through hole is op...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/467F21V33/00
CPCH01L23/367H01L23/467F21V33/0052
Inventor 杜建军李明珠雷堡乐
Owner SHENZHEN FLUENCE TECH
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