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Silver alloy wire for encapsulation and bonding and preparation method thereof

A silver alloy and alloy technology, which is applied in semiconductor/solid-state device manufacturing, circuits, electric solid-state devices, etc., can solve the problems of coating stability, environmental protection requirements, restricted materials, and high manufacturing costs, so as to improve LED luminous attenuation efficiency and facilitate operation , Excellent welding performance

Active Publication Date: 2019-05-14
江苏天康电子合成材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The gold content in the currently developed silver alloy bonding wire reaches 20-55%, such as the CN102776405A patent, whose gold content reaches 20-30%, and the CN104388861A patent, whose gold content reaches 35-55%, and other trace elements are also added in these materials. relatively high cost
There are also inventions that use electroplating to plate gold on the surface of pure silver wire to improve material performance, but the stability of the coating and environmental protection requirements restrict the use and development of materials.

Method used

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  • Silver alloy wire for encapsulation and bonding and preparation method thereof
  • Silver alloy wire for encapsulation and bonding and preparation method thereof
  • Silver alloy wire for encapsulation and bonding and preparation method thereof

Examples

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Embodiment 1

[0045] The present invention relates to a low-cost, high-stability bonding silver alloy wire and a preparation method thereof, wherein the composition of the bonding silver alloy wire is: Au<1%, Pd 1000-10000ppm, Pb 10-200ppm, Mg 5ppm, and the rest for Ag.

[0046] The preparation method comprises the following steps: 1. material preparation; 2. preparation of master alloy; 3. vacuum melting and drawing casting; 4. rough drawing; 5. intermediate annealing;

[0047] 1. Prepare materials. Weigh a number of 99.99% silver ingots, 500g of gold with a purity of not less than 99.99%, 2kg of industrial pure palladium flakes, 500g of pure magnesium pellets, and 500g of lead pellets.

[0048] 2. Preparation of master alloy.

[0049] aPut 1.5kg of palladium flakes into the crucible, heat the temperature to 1600 degrees under vacuum, after the palladium flakes are completely melted, put 1kg of silver ingots into the molten palladium liquid, stop heating when all the silver is melted, an...

Embodiment 2

[0060] Vacuum melting and drawing casting. Put 4930g of silver ingot into a vacuum furnace and heat it to about 1000 degrees to melt, then add 50g of silver-palladium master alloy described in Example 1, 0.5g of silver-magnesium master alloy, 20g of gold grains, and 0.05g of lead grains in sequence under a protective atmosphere. Stir under vacuum, continue to stir for 10 minutes after all melting, and then carry out drawing casting into 8mm diameter alloy rod.

[0061] 2), rough drawing. The alloy rod was drawn to 3.0 mm by multiple drawing.

[0062] 3), intermediate annealing. The 3.0mm wire is annealed in a protective atmosphere, the annealing temperature is controlled at 400-450 degrees, and the line speed is controlled at about 500mm / min.

[0063] 4), medium selah. The annealed wire rod is drawn to 0.025mm through multiple passes.

[0064] 5), stabilization annealing. The 0.025mm microwire is stabilized by annealing, the annealing temperature is controlled at 400-450...

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Abstract

The invention relates to a silver alloy wire for packaging and bonding and a preparation method thereof, belonging to the technical field of bonding wire processing technology. The silver alloy wire is composed of metal materials with the following weight ratio (wt%): Au<1%, Pd1000-10000ppm, Pb10‑200ppm, Mg5ppm, and the rest are Ag. The preparation method includes: preparing materials; making intermediate alloys; vacuum smelting and drawing casting; making alloy bars into 2-4mm alloy busbars with a rough drawing and drawing machine; performing intermediate online annealing on alloy busbars; The alloy bus bar is drawn into microwires with a diameter of 0.015-0.030mm by a continuous drawing unit; the drawn microwires are stabilized and annealed online to make silver alloy wires. Based on metallurgical physical and chemical principles, the present invention designs a simple and easy alloy composition, greatly increases the content of metal palladium, uses an intermediate alloy to blend into liquid silver, and significantly improves the oxidation resistance of the silver alloy, and adds different amounts of magnesium to adjust the silver through the method of the intermediate alloy. The strong plasticity of the alloy wire, the addition of trace lead elements to enhance the stability of the ball.

Description

technical field [0001] The invention relates to a silver alloy wire for encapsulation and bonding and a preparation method thereof, belonging to the technical field of bonding wire processing technology. Background technique [0002] There are many kinds of microwires for bonding, such as gold wire, silver wire, copper wire, palladium-plated copper wire, silver-plated gold, etc., but the overall performance is still better than gold wire, especially for many years, various bonding equipment is also suitable for gold wire. The stability of the gold wire is also recognized. Although the cost of newly developed single crystal copper wire has been greatly reduced compared with gold wire in recent years, it is difficult to popularize and apply it at present due to the strong toughness of copper wire, especially its poor oxidation resistance. Palladium-plated copper wire, silver-plated gold, etc. have solved the oxidation problem of the bonding wire, but the electroplating causes...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/49H01L21/48C22C5/06C22F1/14
CPCC22C5/06C22F1/14H01L24/43H01L24/45H01L2224/45139H01L2224/45144H01L2224/43H01L2224/43848H01L2924/12041H01L2924/01047H01L2924/00H01L2924/00015H01L2924/013H01L2224/45344H01L2224/45147H01L2224/45H01L2224/45565H01L2224/45664H01L2924/00011H01L2924/01079H01L2924/01082H01L2924/01012H01L2924/01046H01L2924/00012H01L2924/00014H01L2924/01049H01L2924/01005
Inventor 李康李松林李扣民曹鹏谭佃龙余新泉
Owner 江苏天康电子合成材料有限公司
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