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Processing apparatus

A technology for processing equipment and workpieces, which can be applied to grinding equipment, metal processing equipment, grinding/polishing safety devices, etc., and can solve problems such as reduced operating rate of processing equipment and damage to workpieces.

Inactive Publication Date: 2019-02-26
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, since the timing of this cleaning is determined based on, for example, the operator's experience, etc., the frequency of cleaning may be more than necessary to reduce the operating rate of the processing equipment.
On the other hand, when the timing of cleaning is too late, machining chips fall from the inner wall of the cover and enter the gap between the machining tool and the workpiece, causing greater damage to the workpiece

Method used

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  • Processing apparatus
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Examples

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Embodiment Construction

[0014] An embodiment of one embodiment of the present invention will be described with reference to the drawings. figure 1 It is a perspective view schematically showing a configuration example of the polishing apparatus (processing apparatus) 2 of this embodiment. Such as figure 1 As shown, the polishing device 2 has a base 4 that supports each component. A wall-shaped support structure 6 is provided at the rear end of the base 4 .

[0015] An opening 4 a is formed on the front side of the upper surface of the base 4 , and the conveying unit 8 for conveying a plate-shaped workpiece 11 is arranged in the opening 4 a. The workpiece 11 is, for example, a disk-shaped wafer made of a material such as silicon (Si). However, the material, shape, structure, size, etc. of the workpiece 11 are not limited. For example, a substrate made of other materials such as semiconductors, ceramics, resins, and metals may be used as the workpiece 11 .

[0016] Cassettes 10 a , 10 b for accomm...

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PUM

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Abstract

A processing apparatus is provided for properly determining the attachment degree of processing waste onto a wall of a processing room. The processing apparatus includes a chuck table configured to hold a plate-shaped workpiece thereon, a processing unit including a spindle having an end portion at which a processing tool for grinding or polishing a workpiece held on the chuck table is to be mounted, a processing room surrounded by a wall and configured to accommodate the chuck table and the end portion of the spindle therein, and a dirty situation indication unit configured to indicate a degree of adhesion of processing waste, which is generated by grinding or polishing of the workpiece, to the wall. The dirty situation indication unit includes a transmission window made of a member thatpasses visible rays therethrough and configuring part of the wall, and a color sample indication unit indicative of a relationship between an amount of the processing waste adhering on the transmission window and a color of the transmission window.

Description

technical field [0001] The present invention relates to a processing device for processing a plate-shaped workpiece. Background technique [0002] In order to reduce the size and weight of device chips incorporated into electronic equipment, etc., opportunities to process thinner wafers, package substrates, etc. before being divided into device chips increase. For this processing, for example, a processing device having a main shaft (rotary shaft) on which processing tools such as grinding stones and polishing pads are attached is used. By bringing a processing tool rotated by a spindle into contact with a workpiece such as a wafer or a package substrate, the workpiece can be thinned. [0003] In addition, when a workpiece is processed by the processing apparatus as described above, a large amount of processing chips (dust) are generated and scattered around. Therefore, a method has been proposed in which a cover is provided on a processing device to cover the tip end of a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B55/06B24B41/00B24B37/34B24B37/10B24B7/07
CPCB24B7/07B24B37/10B24B37/345B24B41/005B24B55/06B24B27/0069B24B41/02B24B41/068B24B49/12H01L21/67242H01L21/67028H01L21/67092
Inventor 掛札将树
Owner DISCO CORP