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Chip package having a flexible substrate

A chip packaging, flexible technology, applied in nonlinear optics, optics, instruments, etc., can solve problems such as damage to electronic components, curved panels pressing electronic components, etc.

Inactive Publication Date: 2019-04-05
CHIPBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current electronic products tend to be light, thin and bendable, such as electronic products such as TVs or mobile phones with curved screens. However, since the screens of electronic products are curved panels, the curved panel will press the electronic components, resulting in electronic components damage

Method used

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  • Chip package having a flexible substrate
  • Chip package having a flexible substrate
  • Chip package having a flexible substrate

Examples

Experimental program
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Effect test

Embodiment Construction

[0034] see figure 1 and figure 2 , a chip packaging structure 100 with a flexible substrate of the present invention includes a flexible substrate 110 (for example, a substrate used in a tape carrier package (Tape Carrier Package, TCP) or a chip-on-film package (Chip on Film) , COF) substrate), the chip 120 and the reinforcing sheet 130 and the anti-pressure member 140 respectively arranged on different surfaces of the flexible substrate 110 .

[0035] see figure 1 and figure 2 , the flexible substrate 110 has a first surface 111 and a second surface 112, the chip 120 is disposed on the first surface 111 of the flexible substrate 110, the chip 120 has an active surface 121 and a back surface 122, the active surface 121 faces the first surface 111 and is electrically connected to the flexible substrate 110, please refer to image 3 and Figure 4 , in this embodiment, the chip 120 is electrically connected to the plurality of conductive pads 110a of the flexible substra...

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PUM

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Abstract

A chip package having a flexible substrate is provided. A chip and a pressure-proof member are located on a first surface of a flexible substrate, and a reinforcement sheet is located on a second surface of the flexible substrate. The pressure-proof member at least includes a pair of pressure-proof ribs which are located outside of the chip oppositely. The pressure-proof ribs located outside the chip can protect the chip from the damage caused by the pressure of other component (e.g. curved panel) except the chip package.

Description

technical field [0001] The present invention relates to a chip packaging structure with a flexible substrate, which is used to prevent the chip disposed on the flexible substrate from being damaged due to being pressed by components other than the packaging structure (such as a curved panel). Background technique [0002] The current electronic products tend to be light, thin and bendable, such as electronic products such as TVs or mobile phones with curved screens. However, since the screens of electronic products are curved panels, the curved panel will press the electronic components, resulting in electronic components damage. [0003] see Figure 5 A liquid crystal display screen 10 of an electronic product has a curved panel 11 and a chip 13 arranged on a circuit substrate 12. Since the curved panel 11 bends and presses the chip 13, the chip is damaged and cannot be electrically connected to the circuit substrate 12. Sexual connection, relatively, also increases the de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/00
CPCH01L23/562H01L23/4985H01L24/16H01L24/32H01L2224/16227H01L2224/32225H01L2224/73204H01L2224/16225H01L2924/00H01L23/485H01L23/538H01L23/5387H01L24/28G02F1/13394G02F2201/50H01L23/3185H01L23/367
Inventor 苏俊扬王昭昕杨念慈罗信伟
Owner CHIPBOND TECH