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Clamping and feeding mechanism for adjusting cylindricity of semiconductor silicon rod

A technology of feed mechanism and cylindricity, which is applied in the direction of machine tools designed for grinding the rotating surface of workpieces, grinding racks, and parts of grinding machine tools. The angle adjustment of the material axis, the inability to meet the production demand and other problems, achieve the effect of meeting the requirements of cylindricity

Pending Publication Date: 2019-04-19
QINGDAO GAOCE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When it is necessary to grind round rods, the working condition that the bar axis deviates from the grinding feed direction occurs, the angle adjustment of the bar axis cannot be realized, the requirements for the cylindricity of silicon rods cannot be met, and the production needs cannot be met.

Method used

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  • Clamping and feeding mechanism for adjusting cylindricity of semiconductor silicon rod
  • Clamping and feeding mechanism for adjusting cylindricity of semiconductor silicon rod
  • Clamping and feeding mechanism for adjusting cylindricity of semiconductor silicon rod

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Embodiment Construction

[0026] The core of the present invention is to provide a clamping and feeding mechanism for adjusting the cylindricity of semiconductor silicon rods. The clamping and feeding mechanism can not only clamp the rod and drive the rod to rotate, but also adjust the axis direction of the rod. Realize the round bar grinding of the bar and meet the requirements of cylindricity.

[0027] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention. Based on the embodiments in the present application, other similar embodiments obtained by persons of ordinary skill in the art without making creative efforts shall all fall within the protection scope of the present application. In addition, the directional terms mentioned in the following embodiments, such as "up", "down", ...

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Abstract

The invention discloses a clamping and feeding mechanism for adjusting the cylindricity of a semiconductor silicon rod. The clamping and feeding mechanism comprises a feeding sliding table, an adjusting assembly, a rotary connecting table and a clamping mechanism arranged on the rotary connecting table. The rotary connecting table is arranged on the feeding sliding table and driven by the adjusting assembly to horizontally rotate, multiple pressing plates are arranged on the feeding sliding table, the pressing plates are arranged into L-shaped structures, one ends of the pressing plates are detachably mounted on the feeding sliding table, and the other ends of the pressing plates are arranged on the rotary connecting table. The clamping mechanism comprises a headstock assembly and a tailstock assembly opposite to the headstock assembly. A convex block is arranged at one end, in the feeding direction of the rod, of the rotary connecting table, the headstock assembly is fixedly mounted on the convex block, and the tailstock assembly can be slidingly mounted on the rotary connecting table in the feeding direction of the rod back and forth. The clamping and feeding mechanism can clampthe rod and drive the rod to rotate, the axis direction of the rod can also be adjusted, round rod grinding of the rod is achieved, and the cylindricity requirement is met.

Description

technical field [0001] The invention relates to the technical field of silicon rod processing equipment accessories, in particular to a clamping and feeding mechanism for adjusting the cylindricity of semiconductor silicon rods. Background technique [0002] When the semiconductor spheronizer grinds the bar, the clamping mechanism clamps the bar and rotates the silicon rod for spheroidal grinding. The angle of the bar axis relative to the grinding feed direction in the clamping mechanism of the existing semiconductor spheronizer is a fixed value and cannot be adjusted, and it completely depends on the state of the equipment when it is assembled. When the round bar needs to be ground, the working condition that the bar axis deviates from the grinding feed direction occurs, the angle adjustment of the bar axis cannot be realized, the requirement for the cylindricity of the silicon rod cannot be met, and the production demand cannot be met. In view of the above problems, the p...

Claims

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Application Information

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IPC IPC(8): B24B5/04B24B41/06B24B41/02B24B47/20
CPCB24B5/04B24B41/02B24B41/06B24B47/20
Inventor 段景波戴鑫辉徐公志郭世峰乔石
Owner QINGDAO GAOCE TECH CO LTD