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A burr-free milling process for rigid-flex board

A rigid-flex board, burr-free technology, applied in the field of burr-free milling and cutting technology, can solve problems such as burr phenomenon, burr cannot be effectively removed, and insufficient resistance to warpage of the flexible layer.

Active Publication Date: 2020-12-29
江西弘信柔性电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When processing the shape of a rigid-flexible board with a short flexible layer, the die stamping method has the advantages of fast speed, good effect, and no burrs. When the length of the flexible layer is greater than 100mm, the rigid layer at the rigid-flexible The supporting force of the flexible layer is not enough to resist the warping of the flexible layer, so direct punching will cause large burrs, and the burrs cannot be effectively removed in the subsequent process

Method used

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  • A burr-free milling process for rigid-flex board
  • A burr-free milling process for rigid-flex board
  • A burr-free milling process for rigid-flex board

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Embodiment Construction

[0024] In order to deepen the understanding of the present invention, the present invention will be further described below in conjunction with the embodiments and accompanying drawings. The embodiments are only used to explain the present invention and do not constitute a limitation to the protection scope of the present invention.

[0025] A burr-free milling process for rigid-flex boards, such as figure 1 As shown, the rigid-flex board is firstly pretreated and laminated, and then the shape of the rigid-flex board is processed. At this time, the overall shape of the rigid-flex board has a margin, and the margin is processed to obtain the shape Rigid-flex board whose size meets the design value;

[0026] The process of milling allowance includes the following steps;

[0027] 1) Pre-milling: Carry out preliminary milling on the area where the flexible layer 2 is located and chamfer the rigid layer 1, and expand outward by 0.15mm during chamfering; that is, there is still a 0...

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Abstract

The invention discloses a burr-free milling process of a rigid-flex printed circuit board. The burr-free milling process comprises the steps of pre-milling, primary die punching, secondary die punching and finish-milling; and through the cooperation of two times of milling and two times of punching, rigid-flex printed circuit boards with no burr can be processed.

Description

technical field [0001] The invention relates to a burr-free milling process for a rigid-flexible plate. Background technique [0002] As a new type of board that can be connected in 3D, the rigid-flex board is more and more popular in the market due to its small size and powerful functions. [0003] With the increase in the use of rigid-flex boards, there are more and more rigid-flex boards with a flexible layer length greater than 100mm. When the flexible layer is too long, the difficulty of milling the shape of the rigid-flex board will increase with the It increases exponentially with the increase of the length and thickness of the rigid-flex board. [0004] When processing the shape of a rigid-flexible board with a short flexible layer, the die stamping method has the advantages of fast speed, good effect, and no burrs. When the length of the flexible layer is greater than 100mm, the rigid layer at the rigid-flexible The supporting force of the flexible layer is not en...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P15/00B21D28/02B21D28/14
CPCB21D28/02B21D28/14B23P15/00
Inventor 李胜伦丁显然
Owner 江西弘信柔性电子科技有限公司
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