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A Method for Improving the Local Deformation of the Inner Cover Board of Multilayer Printed Circuit Board

A local deformation, printed circuit technology, applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve problems such as welding deviation, affecting the reliability and quality of electronic products, deformation, etc., to achieve the effect of improving local deformation

Active Publication Date: 2021-03-19
广州广合科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the differences in PCB design graphics, the deformation of the material itself, and the influence of the manufacturing process, etc., it will cause irregular deformation problems in different units and different sets of boards in the same large board. This irregular deformation will lead to The solder paste printed on the circuit board before the component is offset, soldering deviation, virtual soldering, etc., which seriously affect the reliability and quality of electronic products

Method used

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  • A Method for Improving the Local Deformation of the Inner Cover Board of Multilayer Printed Circuit Board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A method for improving the local deformation of the inner sleeve of a multilayer printed circuit board, characterized in that it comprises the following steps:

[0019] S1. Identify the area of ​​local deformation: the inner sleeve of the large jigsaw panel includes 16 units, select a reference point A during measurement, take the vertical distance between each unit and the reference point A as the measurement value point, and set the large The inner cover board of the panel is sequentially set as the B-Q area, and in the B-Q area, the area where the deformation occurs is identified through the dielectric layer thickness, plate thickness, thermal stress test, and Tg test comparison;

[0020] S2. Reduce the amount of deformation by changing the pressing parameters.

[0021] Further, in the B-Q region, the N region is locally deformed.

[0022] Further, in the B-Q region, the O region is locally deformed.

[0023] Further, the method of changing the pressing parameters ...

Embodiment 2

[0030] A method for improving the local deformation of the inner sleeve of a multilayer printed circuit board, characterized in that it comprises the following steps:

[0031] S1. Identify the area of ​​local deformation: the inner sleeve of the large jigsaw panel includes 16 units, select a reference point A during measurement, take the vertical distance between each unit and the reference point A as the measurement value point, and set the large The inner cover board of the panel is sequentially set as the B-Q area, and in the B-Q area, the area where the deformation occurs is identified through the dielectric layer thickness, plate thickness, thermal stress test, and Tg test comparison;

[0032] S2. Reduce the amount of deformation by changing the pressing parameters.

[0033] Further, in the B-Q region, the N region is locally deformed.

[0034] Further, in the B-Q region, the O region is locally deformed.

[0035] Further, the method of changing the pressing parameters ...

Embodiment 3

[0041] A method for improving the local deformation of the inner sleeve of a multilayer printed circuit board, characterized in that it comprises the following steps:

[0042] S1. Identify the area of ​​local deformation: the inner sleeve of the large jigsaw panel includes 16 units, select a reference point A during measurement, take the vertical distance between each unit and the reference point A as the measurement value point, and set the large The inner cover board of the panel is sequentially set as the B-Q area, and in the B-Q area, the area where the deformation occurs is identified through the dielectric layer thickness, plate thickness, thermal stress test, and Tg test comparison;

[0043] S2. Reduce the amount of deformation by changing the pressing parameters.

[0044] Further, in the B-Q region, the N region is locally deformed.

[0045] Further, in the B-Q region, the O region is locally deformed.

[0046] Further, the method of changing the pressing parameters ...

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Abstract

The invention provides a method for improving the local deformation of a large panel inner sleeve plate of a multi-layer printed circuit. The method comprises the steps of (S1) identifying an area oflocal deformation, selecting a reference point A during measurement, taking a vertical distance between each unit and the reference point A as a measurement value taking point, setting the large panel inner sleeve plate as a B-Q area, and identifying a deformed area through dielectric layer thickness, board thickness, a thermal stress test and Tg test comparison, wherein the large panel inner sleeve plate includes 16 units, and (S2) reducing a deformation amount by changing press-fit parameters. According to the method, processing parameters with smallest local variables are obtained by optimizing the press-fit parameters, and the problem of local deformation of the large panel inner sleeve plate of the multi-layer printed circuit is improved.

Description

technical field [0001] The invention belongs to the technical field of PCB processing, and in particular relates to a method for improving local deformation of an inner cover board of a multilayer printed circuit jigsaw puzzle. Background technique [0002] At present, the demand for miniaturization, thinner and multifunctional electronic products is more and more urgent, which puts forward more and higher requirements for PCB design, manufacturing and reliability testing, and the degree of high density of holes and lines is further improved. The space available for PCB "play" has been severely squeezed. Due to the differences in PCB design graphics, the deformation of the material itself, and the influence of the manufacturing process, etc., it will cause irregular deformation problems in different units and different sets of boards in the same large board. This irregular deformation will lead to The solder paste printed on the circuit board before the component is offset,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 刘小刚黎钦源郑剑坤
Owner 广州广合科技股份有限公司