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Substrate and alignment method and equipment

A substrate and alignment mark technology, which is used in image enhancement, instrumentation, semiconductor/solid-state device testing/measurement, etc., can solve the problems of alignment mark pollution, low accuracy of automatic crimping, etc., and achieve the effect of ensuring correct alignment

Active Publication Date: 2022-02-01
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the manufacturing process of the substrate, the alignment marks in the wiring area of ​​the substrate are often polluted, resulting in low accuracy of automatic crimping

Method used

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  • Substrate and alignment method and equipment
  • Substrate and alignment method and equipment
  • Substrate and alignment method and equipment

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Embodiment Construction

[0053] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0054] Embodiments of the present invention provide a substrate and an alignment method and equipment, which can ensure correct alignment between the substrate and the substrate to be aligned.

[0055] An embodiment of the present invention provides a substrate, the substrate is provided with a substrate alignment mark, and the substrate is also provided with an additional alignment mark different in shape from the substrate alignment mark.

[0056]In this embodiment, an additional alignment mark different in shape from the substrate alignment mark is added to the substrate, so that the additional alignment mark can be grasped after the substrate alignment mark is contaminated, resulting in failure or error in grabbing the substrate ali...

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Abstract

The invention provides a substrate, an alignment method and equipment, and belongs to the technical field of display. Wherein, the substrate is provided with a substrate alignment mark, and it is characterized in that the substrate is also provided with an additional alignment mark different in shape from the substrate alignment mark. Through the technical solution of the present invention, the correct alignment of the substrate and the substrate to be aligned can be ensured.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a substrate and an alignment method and equipment. Background technique [0002] In the production process of OLED (Organic Light Emitting Diode) display products, after the substrate motherboard is cut into multiple substrates, it is necessary to use electrical testing equipment to conduct electrical testing on the substrate. The alignment marks on the substrate and the alignment marks in the wiring area of ​​the substrate are aligned with the substrate to be aligned, so that the pins on the substrate to be aligned and the pins in the wiring area are automatically crimped together. However, during the manufacturing process of the substrate, the alignment marks in the wiring area of ​​the substrate are often polluted, resulting in low accuracy of automatic crimping. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/68H01L21/66H01L23/544H01L51/56
CPCH01L23/544H01L21/68H01L2223/54426H01L2223/54486G06T7/337G06T7/0004G06T2207/30148G06T2207/30204G06T7/74G06T7/001G06T2207/30141H01L21/681H10K71/00
Inventor 唐润民王军王战涛王君龙任星
Owner BOE TECH GRP CO LTD