A light-colored transparent high-temperature-resistant shape-memory polyimide film material and its preparation method

A technology of polyimide film and high temperature resistance, which is applied in the field of light-colored transparent high temperature resistant shape memory polyimide film material and its preparation, and can solve unsatisfactory, poor, glass transition temperature below 300°C , Reduce the heat resistance of polymers and other issues, achieve excellent optical properties, improve heat resistance, and improve optical properties

Active Publication Date: 2021-08-17
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the requirements for heat resistance and transparency are still unsatisfactory
[0004] Chinese patent CN107501551A discloses a polyimide resin and a transparent polyimide film and its preparation method. The transparency of the polyimide film is improved by introducing fluorine-containing groups. When the film thickness is 25 µm, the film The optical transmittance is 88%~95%, but the thermal performance is poor, and the glass transition temperature is below 300°C; Chinese patent CN107286344A discloses a colorless and transparent polyimide film preparation method. The introduction of fluorine element, sulfone group or ether bond into the main chain of imide improves the light transmittance of the film. The light transmittance at 450 nm is above 80%, but the glass transition temperature is below 300°C; Chinese patent CN102911359B discloses A kind of transparent polyimide and its preparation method are disclosed. By introducing alicyclic structure, the transparent performance of the polymer is improved, and the light transmittance at 450 nm is 70%~90%, but it also reduces the polymer Excellent heat resistance, the glass transition temperature of the prepared polyimide film is between 200 ° C and 300 ° C

Method used

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  • A light-colored transparent high-temperature-resistant shape-memory polyimide film material and its preparation method
  • A light-colored transparent high-temperature-resistant shape-memory polyimide film material and its preparation method
  • A light-colored transparent high-temperature-resistant shape-memory polyimide film material and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] (1) At room temperature, add 0.6404 g of 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, 0.8884 g of Hexafluorodianhydride was dissolved by adding 8.6 ml DMAc, stirred and reacted at room temperature for 8 h to obtain a PAA solution;

[0033] (2) Place the PAA solution at room temperature for 12 h for defoaming;

[0034] (3) Coat the defoamed solution on the glass substrate and place it in an oven for thermal imidization. The heating program is 60°C (1h), 80°C (1h), 100°C (1h), 200°C ( 1h), 300°C (1h), to obtain a polyimide film.

Embodiment 2

[0036] (1) At room temperature, add 0.6084 g of 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, 0.8974 g of Hexafluorodianhydride and 0.0288 g of octaaminosilsesquioxane were dissolved in 8.6 ml of DMAc, stirred and reacted at room temperature for 8 h to obtain a PAA solution;

[0037] (2) Place the PAA solution at room temperature for 12 h for defoaming;

[0038] (3) Coat the defoamed solution on the glass substrate and place it in an oven for thermal imidization. The heating program is 60°C (1h), 80°C (1h), 100°C (1h), 200°C ( 1h), 300°C (1h), to obtain a polyimide film.

Embodiment 3

[0040] (1) At room temperature, add 0.5764 g of 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, 0.8974 g of Hexafluorodianhydride and 0.0576 g of octaaminosilsesquioxane were dissolved in 8.6 ml of DMAc, stirred and reacted at room temperature for 8 h to obtain a PAA solution;

[0041] (2) Place the PAA solution at room temperature for 12 h for defoaming;

[0042] (3) Coat the defoamed solution on the glass substrate and place it in an oven for thermal imidization. The heating program is 60°C (1h), 80°C (1h), 100°C (1h), 200°C ( 1h), 300°C (1h), to obtain a polyimide film.

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Abstract

The invention provides a light-colored transparent high-temperature-resistant shape-memory polyimide film material and a preparation method thereof. The polyimide film material not only has excellent high-temperature-resistant shape memory performance (320°C

Description

technical field [0001] The invention relates to the field of high-performance polyimide polymers and their preparation, in particular to a light-colored transparent high-temperature-resistant shape-memory polyimide film material and a preparation method thereof. Background technique [0002] Flexible display has the advantages of ultra-light, ultra-thin, durable, easy to store in large quantities, free design shape, and can be rolled up. It has gradually become the main choice for the development of future display technology. Excellent properties such as self-illumination and high contrast show great development prospects in the display field, which is very in line with the requirements of future flexible display development. In the preparation process of flexible OLED devices, processes such as high-temperature annealing are required, which not only requires the substrate to have excellent optical transmittance, mechanical properties, and chemical resistance, but also requi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08J5/18C08G73/10
Inventor 韦嘉俞燕蕾兰中旭
Owner FUDAN UNIV
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