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A pixel defining layer, its preparation method, and display device

A technology for defining a pixel definition layer and a display device, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., and can solve problems such as the difficulty of printing uniform films

Active Publication Date: 2021-09-14
TCL CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above deficiencies in the prior art, the purpose of the present invention is to provide a pixel defining layer and its preparation method, aiming to solve the problem that it is difficult to print uniform thin films on the existing pixel defining layer

Method used

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  • A pixel defining layer, its preparation method, and display device
  • A pixel defining layer, its preparation method, and display device
  • A pixel defining layer, its preparation method, and display device

Examples

Experimental program
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Effect test

Embodiment 1

[0049] Dissolve epoxy resin EPON826 in methyl isobutyl ketone solvent, put it in a three-necked flask, stir and heat to 70~80°C, according to the mass ratio of epoxy resin to sodium azide 1:1, add sodium azide Soluble in the mixture of water and methyl isobutyl ketone, and slowly add dropwise to the three-necked flask, the dropping time is 0.5~2h, continue to react for 1~3h after the dropwise addition, and then distill under reduced pressure to remove methyl isobutyl base ketone and water, and dissolve the solid in methyl isobutyl ketone, filter to remove sodium azide, obtain azide epoxy resin after vacuum distillation again;

[0050] Heat the azide epoxy resin to 70~80°C to melt, then mix the azide epoxy resin, polyoxypropylene diamine epoxy curing agent, and decylamine at a molar ratio of 4:1:2, and inject placed in a mold on the substrate, cured at 100-110 degrees Celsius for 1-2 hours, and then cured at 130-140 degrees Celsius for 1-2 hours, and after demoulding, an initia...

Embodiment 2

[0053] Dissolve epoxy resin E-51 in methyl isobutyl ketone solvent, put it in a three-necked flask, stir and heat to 60~70°C, according to the mass ratio of epoxy resin to sodium azide 1:1, add azide Dissolve sodium chloride in a mixture of water and methyl isobutyl ketone, and slowly add it dropwise to a three-necked flask for 0.5~2 hours. After the dropwise addition, continue to react for 1~3 hours, and then distill under reduced pressure to remove methyl isobutyl ketone and water, and the solid is dissolved in methyl isobutyl ketone, filtered to remove sodium azide, and then obtained azide epoxy resin after vacuum distillation again;

[0054] Heat the azide epoxy resin to 70~80°C to melt, then mix the azide epoxy resin, polyoxypropylene diamine epoxy curing agent, and decylamine in a molar ratio of 4:1:2, and then inject placed in a mold on the substrate, cured for 1 to 2 hours at 100 to 110 degrees Celsius, and then cured for 1 to 2 hours at 130 to 140 degrees Celsius, and...

Embodiment 3

[0057] Dissolve epoxy resin EPON826 in methyl isobutyl ketone solvent, put it in a three-necked flask, stir and heat to 70~80°C, according to the mass ratio of epoxy resin to sodium azide 1:1, add sodium azide Soluble in the mixture of water and methyl isobutyl ketone, and slowly add dropwise to the three-necked flask, the dropping time is 0.5~2h, continue to react for 1~3h after the dropwise addition, and then distill under reduced pressure to remove methyl isobutyl base ketone and water, and dissolve the solid in methyl isobutyl ketone, filter to remove sodium azide, obtain azide epoxy resin after vacuum distillation again;

[0058] Heat the azide epoxy resin to 70~80°C to melt, and then mix the azide epoxy resin, methyltetrahydrophthalic anhydride, 2-ethyl-4- Methylimidazole is mixed evenly and placed in an oven at 80 degrees Celsius to stand still. After the air bubbles are removed, it is then injected into a mold placed on the substrate, cured at 80~90 degrees Celsius for...

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Abstract

The invention discloses a pixel defining layer, a preparation method thereof, and a display device. The pixel defining layer has a defined area surrounded by a dam body and a side surface of the dam body. The main material of the dam body is azide epoxy resin. The side of the dam body is divided into an upper side and a lower side, the upper side is grafted with hydrophobic groups, and the lower side is grafted with hydrophilic groups. The invention solves the problem that it is difficult to print a uniform film on the existing pixel defining layer.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a pixel defining layer and a preparation method thereof. Background technique [0002] Quantum dots have many advantages such as easy adjustment of luminescent color, high color saturation, solution processability, and high stability, making quantum dot light-emitting diodes (QLED) regarded as a strong competitor for next-generation display technology. In the prior art, methods for preparing quantum dot electroluminescent devices mainly include inkjet printing, transfer printing, etc., among which inkjet printing technology can accurately spray ink containing luminescent functional materials into the pixel area to form a luminescent functional layer , can effectively improve the pixel resolution, but it is difficult for the ink to form a film with uniform thickness in the pixel area. [0003] A pixel-defining layer is usually made on the substrate of an inkjet printing device t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/32H01L51/56
CPCH10K59/122H10K71/00
Inventor 张滔向超宇李乐辛征航王雄志
Owner TCL CORPORATION
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