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Light emitting method and light emitting device

An optical device and beam technology, applied in optics, optical components, laser welding equipment, etc., can solve the conditions of low production capacity, inability to arbitrarily adjust the taper angle of micro holes, and inability to meet the high-speed and adjustable offset path of rectangular taper holes And other issues

Active Publication Date: 2022-01-11
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, laser processing equipment is often limited by the diffraction characteristics of the laser beam, and cannot adjust the micro-hole cone angle arbitrarily, so that the drilling module does not have the ability to process taper holes flexibly, so it cannot meet the local needs of a single laser drilling process. The need to adjust to a straight through hole or a tapered hole, for example, when the slope of the edge side of a rectangular hole is different from the slope at the corner
[0004] Furthermore, in the prior art, a glass plate or a prism-type circular module (Trepan) is rotated by a hollow motor, but only a circular path deviation can be completed, and the rotational speed of the hollow motor is too low (less than 4,000rpm ), resulting in too low production capacity, so it is not only unable to meet the conditions of high-speed and adjustable offset paths required by rectangular tapered holes or other hole-shaped manufacturing processes, but also its drilling size is limited, for example, it is impossible to manufacture diameters smaller than 50 micron (μm) pores

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  • Light emitting method and light emitting device
  • Light emitting method and light emitting device
  • Light emitting method and light emitting device

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Embodiment Construction

[0055] The implementation of the present invention will be described through specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0056] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those familiar with this technology, and are not intended to limit the present invention Therefore, it has no technical substantive meaning, and any modification of structure, change of proportional relationship or adjustment of size shall still fall into the within the scope covered by the technical content disclosed in the present invention. At the same time, terms such as "upper", "lower", "first", "second" and "one" quoted in this specification are only for the convenience of descriptio...

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Abstract

The invention discloses a light extraction method and a light extraction device. The light emitting method is used to pass a laser beam sequentially through at least one offset component and a focusing component, and actuate the offset component through a regulating mechanism to cause the laser beam to be offset, so that in the drilling process, the The laser beam can quickly produce controllable and arbitrary shape openings according to requirements.

Description

technical field [0001] The invention relates to a light output method and a device thereof, in particular to a method for adjusting a light output path and a device thereof. Background technique [0002] Laser micro-hole processing technology has been widely used in many industries, such as probe cards for semiconductor manufacturing process testing, transparent hard and brittle materials, engine fuel injection holes, metal cutting holes and other manufacturing processes. At present, the microholes produced by laser processing equipment are tapered round holes, so it is necessary to cooperate with the drilling module to have the ability to control the taper angle to produce microhole shapes with different requirements, such as the rectangular shape of the probe card. Micro hole processing, straight hole of tempered glass, tapered hole of engine nozzle, etc. [0003] However, laser processing equipment is often limited by the diffraction characteristics of the laser beam, an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B27/28G02B27/09
CPCG02B27/283G02B27/0905B23K26/082B23K26/382
Inventor 胡平浩吕绍铨李炫璋周柏寰李闵凯
Owner IND TECH RES INST