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Substrate processing device

A substrate processing device and a technology for substrates, which are applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as entanglement of two gas pipelines

Active Publication Date: 2019-07-16
GRAND PLASTIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above-mentioned problems in the prior art, the purpose of the present disclosure is to provide a substrate processing device with dual gas source pipelines, which can effectively solve the problem in the prior art that the two gas pipelines will follow the rotation of the turntable. and intertwined issues

Method used

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Embodiment Construction

[0033] In order to make the above and other objectives, features, and advantages of the present disclosure more comprehensible, preferred embodiments of the present disclosure will be exemplified below in detail with accompanying drawings.

[0034] Please refer to figure 1 , which shows a block diagram of a substrate processing apparatus 1 according to a preferred embodiment of the present disclosure. The substrate processing apparatus 1 includes a rotary table 10, a drive unit 20, an air extraction unit 30, and a gas supply unit 40, wherein the drive unit 20 is electrically connected to the rotary table 10 for driving the rotary table 10 to rotate, and the air extraction unit 30 and the gas supply unit 40 The gas supply unit 40 is also respectively connected with the rotary table 10 to provide negative pressure (vacuum) and slightly positive pressure protective gas.

[0035] Please refer to Figure 2 to Figure 5 , figure 2 A perspective view showing a substrate processing...

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Abstract

The invention provides a substrate processing device. The substrate processing device comprises a rotary table contains a first gas channel and a second gas channel, a gas pumping unit connected withthe rotary table and used for keeping the first gas channel in a negative pressure state to keep a substrate on the rotary table, and a gas supply unit connected with the rotary table and used for supplying a protective gas, wherein the protective gas is blown out on the substrate through a second connecting channel and surrounds a substrate bearing part of the rotary table.

Description

technical field [0001] The disclosure relates to a substrate processing device, in particular to a substrate processing device with dual gas source pipelines. Background technique [0002] In a conventional single wafer spin cleaning and etching device, in order to prevent the etching liquid sprayed on the substrate from flowing to the back (bottom) of the substrate, causing contamination of the vacuum chuck and destroying its vacuum suction capability. At present, the industry adopts adding a fixed air injection device next to the single wafer rotary cleaning and etching device, which blows off the liquid flowing to the back of the substrate by spraying air toward the back of the substrate. However, this type of air spray device cannot rotate synchronously with the rotating substrate, so it is difficult to achieve comprehensive protection. [0003] However, there are certain difficulties in integrating the above-mentioned gas injection device into a conventional single-waf...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67023H01L21/67051H01L21/6708H01L21/6838
Inventor 林圣翔
Owner GRAND PLASTIC TECH