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Backlight module and manufacturing method thereof

A backlight module and lithography technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of yellowing of the lamp board, low backlight display effect, abrasion and scratches of the packaging glue, etc.

Active Publication Date: 2021-04-27
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The backlight module provided by this application solves the yellowing phenomenon of the printed circuit board by arranging a glass plate with a metal coating above the packaged printed circuit board and the module assembly with the packaged printed circuit board , low backlight display effect, packaging glue wear and scratches and other problems

Method used

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  • Backlight module and manufacturing method thereof
  • Backlight module and manufacturing method thereof
  • Backlight module and manufacturing method thereof

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Embodiment Construction

[0038] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments that the present application can be used to implement. The directional terms mentioned in this application, such as [top], [bottom], [front], [back], [left], [right], [inside], [outside], [side], etc., are for reference only The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the application, but not to limit the application. In the figures, structurally similar elements are denoted by the same reference numerals.

[0039] Such as figure 1 As shown, this figure is the first cross-sectional structure diagram of the backlight module provided by the embodiment of the present application. figure 1 Among them, the present application provides a backlight module, and the backlight module includes: a printed circuit board 101 and a paint layer 102 disposed on the printed circuit board 101;...

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Abstract

The present application provides a backlight module, which includes: a printed circuit board and a paint layer arranged on the printed circuit board; a plurality of driving chips, and the driving chips are arranged on the paint layer at intervals The packaging adhesive layer is arranged on the paint layer and wraps the driving chip; a plurality of metal plating blocks are arranged on the packaging adhesive layer at intervals, and the projection positions of the metal plating blocks on the paint layer Interlaced with the projection position of the driving chip on the paint layer; the glass plate is laid on the plurality of metal plating blocks. Beneficial effects: under the condition that the backlight module is guaranteed to be at a certain light mixing distance, by arranging a glass plate with a metal coating above the module assembly of the packaged printed circuit board, the phenomenon of yellowing of the lamp board of the printed circuit board and the backlight problem are solved. Problems such as low display effect, wear and scratch of the encapsulation adhesive layer, etc.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a backlight module and a preparation method thereof. Background technique [0002] At present, the Mini Light-Emitting Diode (Mini-LED) display can be compared to Organic Light-Emitting Diode (Organic Light-Emitting Diode). Emitting Diode, referred to as OLED) products, and can be more competitive than OLED in terms of material cost, and are favored by the backlight display industry. [0003] When Mini-LEDs on the market are used as backlights, flip chips are bonded to printed circuit boards (Print Circuit Board, PCB for short). In order to protect the chip from being damaged by external force and external environment during subsequent production, transportation and use, a layer of white paint is usually coated on the surface of the PCB to reflect light, but because flip chips need to undergo high temperature curing on the PCB board Reflow soldering, and the white pa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/56H01L33/60H01L25/075
CPCH01L25/0753H01L33/486H01L33/56H01L33/60H01L2933/0033H01L2933/005H01L2933/0058
Inventor 林悦霞熊充
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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