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Parting method and scribe device of multilayer ceramic substrate

A technology of laminated ceramics and ceramic substrates, applied in stone processing equipment, manufacturing tools, stone processing tools, etc., can solve problems such as difficulty in breaking and inconvenience, and achieve the effect of improving the accuracy of end faces

Inactive Publication Date: 2019-07-23
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that it is difficult to break and it is not separated according to the scored line as shown in Fig. 2(e)
[0008] This shows that the above-mentioned existing ceramic bonded substrate obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

Method used

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  • Parting method and scribe device of multilayer ceramic substrate
  • Parting method and scribe device of multilayer ceramic substrate
  • Parting method and scribe device of multilayer ceramic substrate

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Embodiment Construction

[0032] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation of the method for breaking and marking the laminated ceramic substrate according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. , structure, feature and effect thereof, detailed description is as follows.

[0033] image 3 A schematic perspective view showing an example of a scribing device used for dividing the laminated ceramic substrate according to the embodiment of the present invention. In this scribing apparatus 10, the moving table 11 is held movably in the y-axis direction along a pair of guide rails 12a and 12b. The ball screw 13 is screwed with the moving table 11 . The ball screw 13 is rotated by the drive of the motor 14, and moves the moving table 11 in the y-axis direction along the guide rails 12a, 12b. A motor 15 is p...

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Abstract

The aim of the present invention relates to breaking a laminated ceramic substrate with a metal film laminated on a ceramic substrate. Trench groove processing is performed on the metal films of the laminated ceramic substrate by a patterning tool following the predetermined scribing lines. Then scribed lines are formed from the trench groove or of the metal film or on the ceramic substrate by thescribing tool. Then the laminated ceramic substrate is turned over to proceed breaking along the scribed lines, such that the laminated ceramic substrate can be broken completely.

Description

[0001] This application is a divisional application of the invention patent application with the application number 201310337997.5 titled "Laminated Ceramic Substrate Breaking Method and Scribing Device". The filing date of the original application is August 2, 2013. technical field [0002] The present invention relates to a laminated ceramic substrate, in particular to a cutting method and a marking device for a laminated ceramic substrate on which a metal film is laminated. Background technique [0003] Conventionally, when dividing a laminated ceramic substrate in which a metal film is laminated on a ceramic substrate, the division is often performed using a wafer dicing machine or the like. In addition, Patent Document 1 proposes a method of manufacturing a ceramic bonded substrate in which a metal layer is bonded after scribing a ceramic substrate, removing the metal layer at the scribed line by etching, and then fracturing. [0004] [Problem to be Solved by the Invent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/26B23D79/00
Inventor 武田真和村上健二田村健太
Owner MITSUBOSHI DIAMOND IND CO LTD