Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Computer case capable of increasing internal heat dissipation space of computer

A technology for cooling space and computer, applied in the computer field, can solve problems such as poor heat dissipation effect, and achieve the effect of good heat dissipation effect, large spacing and small space occupation

Active Publication Date: 2019-09-06
HUAINAN UNITED UNIVERSITY
View PDF6 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention proposes a computer case that improves the internal heat dissipation space of the computer, which solves the problems of fixed structure of the existing computer case, compact internal structure of the case, and poor heat dissipation effect

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Computer case capable of increasing internal heat dissipation space of computer
  • Computer case capable of increasing internal heat dissipation space of computer
  • Computer case capable of increasing internal heat dissipation space of computer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment 1, with reference to Figure 1-3 , a computer case that improves the heat dissipation space inside the computer, comprising a housing 3 and two movable plates 8, the top of the housing 3 is provided with two air inlet holes, and a partition plate 15 is installed on the top of the housing 3, The joint between the partition plate 15 and the housing 3 is sealed, and a through hole is opened on the partition plate 15. The bottom end of the through hole is connected with a bottom-sealed installation cylinder 1, and a fan 14 is installed on the inside of the installation cylinder 1. A plurality of air outlet holes 2 are opened on the outer wall of the installation cylinder 1, and a plurality of communication holes 31 are opened on the side wall of the housing 3. The communication holes 31 are located on the left and right sides of the installation cylinder 1, and the communication holes 31 Both are slidably connected with a heat dissipation mechanism 7 installed, a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the field of computers, in particular to a computer case capable of increasing internal cooling space of a computer. An existing computer case is fixed in structure, mechanisms in the case are compact, heat dissipation effect is poor, the following scheme is provided, the computer case comprises a shell and a movable plate, an air inlet hole is formed in the top end of theshell; a partition plate is installed on the upper portion in the shell. A through hole is formed in the partition plate; the bottom end of the through hole is connected with a mounting cylinder witha sealed bottom end; a second fan is installed on the upper portion of the interior of the installation barrel, a plurality of air outlet holes are formed in the outer side wall of the installation barrel, a plurality of communicating holes are formed in the side wall of the shell and located in the two sides of the installation barrel, installation heat dissipation mechanisms are connected intothe communicating holes in a sliding mode, and one ends of the installation heat dissipation mechanisms are fixed to the movable plate. The computer case can provide cooling space for a computer during working, the distance between parts is large, the cooling effect is good, and the computer cooling device is not used and occupies space.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a computer case for improving the heat dissipation space inside the computer. Background technique [0002] With the development of science and technology, computers can handle more and more tasks. When a computer handles large and complex tasks, it generates a huge amount of heat. If this part of the heat is not discharged in time, it will affect the performance of the computer, so the heat dissipation structure was born. [0003] Most of the existing computers have a fixed structure, and the size of their internal space will not change after the manufacture is completed. The internal structure of the existing computer case is compact, and the distances between the components are similar, and heat accumulation is prone to occur during heat dissipation. It is easy to affect the running speed of the internal components of the computer, and at the same time, it is easy to shorte...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/183G06F1/20
Inventor 刘福刚胡舜良杨高明
Owner HUAINAN UNITED UNIVERSITY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com