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Glue dispensing and sealing mechanism for light-emitting diode production and its application method

A technology of light emitting diodes and sealing mechanism, which is applied to devices and coatings that apply liquid to the surface, can solve the problems of no glue replacement structure, poor flexibility, single function, etc., and achieves convenient operation and flexible use of raw material replacement. Effect

Active Publication Date: 2020-09-01
ANHUI MINGYANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Reference document CN107096686A discloses a dispensing equipment for processing diode electronic components, including a bottom plate, a left frame, a mounting plate, a stirring device, a feeding hopper, an electric control valve, a first hose, a one-way valve, and a second hose , mobile device, right frame, lifting device, lifting plate, glue delivery device and placing table, which have poor flexibility and cannot perform arbitrary position adjustment operations
[0004] The existing dispensing and sealing mechanism for LED production has certain disadvantages in the process of use. The traditional dispensing and sealing mechanism for LED production adopts an integrated fixed structure design, so that the dispensing and sealing mechanism cannot be adjusted according to the position of the LED glue tank. The glue gun of the glue sealing mechanism is adjusted arbitrarily, and the traditional glue dispensing and sealing mechanism for LED production does not have a glue replacement structure, so that the dispensing and sealing mechanism can only use a single fluorescent glue at a time, so that the dispensing and sealing mechanism It is impossible to replace its dispensing raw materials during use, and the function is relatively single, which brings certain adverse effects to users

Method used

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  • Glue dispensing and sealing mechanism for light-emitting diode production and its application method
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  • Glue dispensing and sealing mechanism for light-emitting diode production and its application method

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Embodiment Construction

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0030] Such as Figure 1-5 As shown, a dispensing and sealing mechanism for light-emitting diode production includes a fixed base 3, a sealing shield 6, a telescopic card holder 12 and a three-way connecting pipe 22, and the telescopic card holder 12 is composed of a first swivel 17, a supporting inner rod 18 and The second swivel 19 is formed, and the first swivel 17 and the second swivel 19 are all movably installed on the inner side of the telescopic card frame 12, and the firs...

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Abstract

The invention discloses an adhesive dispensing sealing mechanism for light emitting diode production. The adhesive dispensing sealing mechanism comprises a fixing base, a sealing protective cover, a telescopic clamping frame and a three-way connection pipe; the telescopic clamping frame is composed of a first rotary ring, a supporting inner rod and a second rotary ring, the first rotary ring and the second rotary ring are both movably installed on the inner side of the telescopic clamping frame and movably connected with the telescopic clamping frame through rotary shafts, and the inner sidesof the bottoms of the first rotary ring and the second rotary ring are both fixedly sleeved with sealing bottom rings; the supporting inner rod is fixedly installed in the middle of the inner side ofthe telescopic clamping frame; the telescopic clamping frame is in butt joint with and fixed to a sealing adhesive gun through the first rotary ring and the second rotary ring; and the three-way connection pipe is fixedly connected to the upper end of the sealing adhesive gun in a sleeving mode. According to the adhesive dispensing sealing mechanism for light emitting diode production and a usingmethod thereof, using of the sealing mechanism is more flexible through the combined fixing structure, the application range of the sealing mechanism is widened, and the sealing mechanism has the ascending and descending switching structure, and raw material transferring is facilitated.

Description

technical field [0001] The invention belongs to the technical field of diode processing, and in particular relates to a glue dispensing and sealing mechanism, in particular to a glue dispensing and sealing mechanism for the production of light-emitting diodes and a method for using the glue dispensing and sealing mechanism. Background technique [0002] The dispensing and sealing mechanism for LED production is a device for dispensing and fixing LEDs. It is an automatic machine that controls the fluid and applies the fluid to the surface or inside of the product; [0003] Reference document CN107096686A discloses a dispensing equipment for processing diode electronic components, including a bottom plate, a left frame, a mounting plate, a stirring device, a feeding hopper, an electric control valve, a first hose, a one-way valve, and a second hose , mobile device, right frame, lifting device, lifting plate, glue delivery device and placement table, which have poor flexibility...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/02B05C11/00B05C11/10B05C13/02
CPCB05C5/0212B05C11/00B05C11/1036B05C13/02
Inventor 陈敏顾亚英邓肖肖
Owner ANHUI MINGYANG ELECTRONICS
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