Stamp for transferring device and method for transferring device by using same

A stamp and device technology, applied in the field of stamps and using the stamp to transfer devices to non-adhesive target substrates, can solve the problems of limited contact area, difficulty, and small adhesion, and achieve the effect of improving the success rate of device transfer

Inactive Publication Date: 2019-09-20
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

if still use Figure 1A to Figure 1F The soft stamp shown imprints the device onto these target substrate surfaces, the adhesion between the device and the target substrate will be less than the adhesion between the device and the soft stam

Method used

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  • Stamp for transferring device and method for transferring device by using same
  • Stamp for transferring device and method for transferring device by using same
  • Stamp for transferring device and method for transferring device by using same

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Embodiment Construction

[0029] The following examples can enable those skilled in the art to understand the present invention more fully, but do not limit the present invention in any way.

[0030] The present invention provides a soft stamp, which has a base and a plurality of protruding structures connected to the base, wherein the heights of the protruding structures are different, the shapes of the protruding structures can also be different, and can have the same or different Arrangement, the arrangement of the protruding structures includes but is not limited to: uniform arrangement of protruding structures of the same height; protruding structures of different heights are arranged at intervals, and protruding structures of lower height are arranged in the middle area, while higher ones are arranged in the peripheral area. protrusion structure.

[0031] The protruding structures include but are not limited to cones and rectangles, such as cones with quadrangular pyramid structures.

[0032] Th...

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PUM

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Abstract

The invention provides a stamp for transferring a device and a method for transferring a device by using the same. The stamp comprises: a base and a plurality of protruding structures connected to the base, wherein the protruding structures have different heights. The strong-to-weak conversion of the adhesion between the soft stamp and the device is achieved by machining a special structure on the surface of the soft stamp, thereby improving a device transfer success rate.

Description

technical field [0001] The present application relates to a stamp and a method for transferring a device to a non-adhesive target substrate using the stamp, and more particularly, to a soft stamp and the transfer of a flexible device to a non-adhesive target substrate using the stamp using dry transfer printing Methods. Background technique [0002] In recent years, thanks to the advancement of materials and flexible electronics processing technology, flexible electronics has achieved remarkable development. At present, most electronic devices are based on hard substrates. These electronic devices have disadvantages such as large size, inflexibility, and inability to attach to the surface of objects, which cannot meet the needs of certain applications, such as sticking to the surface of human skin for blood pressure detection. Pressure Sensor. Flexible electronics have the characteristics of light weight, small size, bendable, stretchable, and can be attached to the surfac...

Claims

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Application Information

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IPC IPC(8): H01L21/18H01L51/00
CPCH01L21/187H10K71/211H10K77/111Y02E10/549
Inventor 庞慰张林江源张孟伦高传海
Owner TIANJIN UNIV
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