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Tape punching apparatus and tape punching method

A kind of equipment and belt area technology, applied in the direction of bundling materials and parts of bundling machinery, etc., can solve the problems of lowering the quality of shipments, separation of trays 1a, and falling of semiconductor packages 10, etc., and achieve the effect of improving the quality of shipments

Active Publication Date: 2019-09-24
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the existing tape operation, manual removal of the Velcro tape may easily cause separation of the upper and lower trays 1a, causing the semiconductor package 10 on the tray 1a to fall, thus causing damage to the semiconductor package 10
[0004] In addition, when carrying out the tape operation, since the position of each tape will be different according to the demand, and the tape conditions of the shipment will also change according to the demand, so it is easy to operate the tape machine manually (or operator) Taping errors occur, resulting in reduced shipment quality

Method used

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  • Tape punching apparatus and tape punching method
  • Tape punching apparatus and tape punching method
  • Tape punching apparatus and tape punching method

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Embodiment Construction

[0067] The implementation of the present invention will be described below with reference to specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0068] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for the understanding and reading of those skilled in the art, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "upper", "low...

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Abstract

The present invention provides a tape punching apparatus and a tape punching method. A removal device automatically removes a magic tape that fastens a plurality of trays, to replace the conventional mechanism that the magic tape is removed by labors and prevent the trays from being separated one another. Therefore, the semiconductor packages received on the trays are prevented from falling to the ground and damaged.

Description

technical field [0001] The present invention relates to a device for packaging finished semiconductors, in particular to a tape-tying device and a tape-typing method for packaging and shipping operations. Background technique [0002] see figure 1 , in the traditional semiconductor packaging process, the semiconductor package 10 will be placed in the tray (tray) 1a after the molding operation, and a plurality of trays 1a are stacked to form the figure 1 As shown in the stacking group 1 with six pallets 1a, the stacking group 1 is bound directly with a magic belt (not shown) manually and stored in the warehouse, and the magic belt is manually disassembled before shipment. The operator then operates the tape machine to carry out the tape operation in the X direction and the Y direction, that is, to arrange the packaging tape (not shown) in the appearance of the stacking group 1 . [0003] However, in the existing tape operation, manual disassembly of the Velcro tape may easi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B13/02B65B13/18
CPCB65B13/02B65B13/18
Inventor 陈金发庄孟宗王维宾林恩立郑坤一
Owner SILICONWARE PRECISION IND CO LTD
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