Electroplating terminal surface polishing device

Abstract

The invention discloses an electroplating terminal surface polishing device. The electroplating terminal surface polishing device is characterized by comprising a rack, and an installing plate is arranged on the top of the rack, and provided with two polishing wheels; the polishing wheels comprise the left side polishing wheel and the right side polishing wheel; the left side polishing wheel is arranged on the left side of the right side polishing wheel, and arranged close to the rear side of the installing plate; the right side polishing wheel is arranged close to the front side of the installing plate; a transverse interval and a longitudinal interval are arranged between the left side polishing wheel and the right side polishing wheel; a left side material blocking wheel is rotationally arranged on the left side of the bottom face of the installing plate; a right side material blocking wheel is arranged on the right side of the bottom face of the installing plate; the left side material blocking wheel is arranged in front of the left side of the left side polishing wheel; and the right side material blocking wheel is arranged behind the right side of the right side polishing wheel. The electroplating terminal surface polishing device improves the polishing efficiency and quality, and lowers the labor intensity of an operator.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to an electroplating terminal surface polishing device. Background technique [0002] In the prior art, after the surface of the copper terminal is electroplated, oxidation may occur, causing the surface of the copper terminal to be dull. Generally, the operator needs to manually polish it. In this way, the efficiency is low, the labor intensity of the operator is high, and the quality is not good enough. . In other words, the electroplated terminal is directly polished between two sets of polishing wheels. In this way, the surface of the terminal has different flatness, which will lead to poor polishing quality. Contents of the invention [0003] The object of the present invention is to provide a surface polishing device for electroplating terminals. By using this structure, the production efficiency and quality of products can be improved, and the labor intensity of operators can...

AI Technical Summary

Problems solved by technology

[0002] In the prior art, after the surface of the copper terminal is electroplated, oxidation may occur, causing the surface of the copper terminal to be dull. Generally, the operator needs to manually polish it. In this way, the efficiency is low, the labor intensity of the operator is high, and the quality is not good enough.

In other words, the electroplated terminals are directly polished between two sets of polishing wheels. In this way, the terminals have different surface flatness, which will lead to poor polishing quality.

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