Electronic device, elastic piece assembly thereof, and elastic piece thereof

A shrapnel and component technology, applied in the direction of radiating element structure, antenna support/installation device, etc., can solve the problems of poor reliability and integrity, complex process, difficult implementation, etc., and achieve good reliability and transfer. Less and more competitive effect

Pending Publication Date: 2019-10-01
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] For electronic products currently on the market, large screen-to-body ratio is a development trend, which requires that the borders around the display screen become narrower and narrower. A common method in the prior art is to make the surrounding borders into metal and then T-process them. , and then inject plastic, and finally insert the frame into the frame and connect it with the

Method used

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  • Electronic device, elastic piece assembly thereof, and elastic piece thereof
  • Electronic device, elastic piece assembly thereof, and elastic piece thereof
  • Electronic device, elastic piece assembly thereof, and elastic piece thereof

Examples

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Embodiment Construction

[0018] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present invention, but not to limit the scope of the present invention. Likewise, the following embodiments are only some but not all embodiments of the present invention, and all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0019] The terms "first", "second", and "third" in the present invention are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least ...

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PUM

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Abstract

The invention provides an electronic device, an elastic piece assembly thereof and an elastic piece thereof. The elastic piece includes an integrated structure which comprises a main body portion, a mounting portion and elastic legs. The mounting portion and the elastic legs are respectively connected to the main body portion, the mounting portion is provided with a mounting hole, and the elasticpiece is connected to an external device through the mounting hole. The elastic legs are used for abutting with an external device to allow the external device connected to the mounting portion and the elastic legs to be in electrical conduction. The elastic piece provided by the embodiment of the invention has a simple structure, an antenna (metal frame) can be connected to a main board (PCB), the transfer is less, the resistance is low, the reliability is good, the edge of the electronic device can be narrowed to the extreme, therefore, the screen ratio can be higher, and the competitivenessof electronic device is improved.

Description

technical field [0001] The present invention relates to the technical field of the internal structure of electronic equipment, in particular to an electronic equipment and its shrapnel assembly and shrapnel. Background technique [0002] For electronic products currently on the market, large screen-to-body ratio is a development trend, which requires that the borders around the display screen become narrower and narrower. A common method in the prior art is to make the surrounding borders into metal and then T-process them. , and then inject plastic, and finally insert the frame into the frame and connect it with the middle frame by integral injection molding. The surrounding frame metal is used as an antenna to be connected to the main board. This technical solution in the prior art has a complicated process and is relatively difficult to implement Difficult, the reliability and integrity of the integral injection molding of the middle frame and the metal frame are not very...

Claims

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Application Information

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IPC IPC(8): H01Q1/36H01Q1/12H01Q1/22
CPCH01Q1/36H01Q1/12H01Q1/22
Inventor 陈佳
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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